5176381-1

Series:	Free Height (FH)
Packaging:	Bulk
Part Status:	Active
Connector Type:	Plug, Center Strip Contacts
Number of Positions:	40
Pitch:	0.050" (1.27mm)
Number of Rows:	2
Mounting Type:	Through Hole, Right Angle
Features:	Board Lock
Contact Finish:	Gold
Contact Finish Thickness:	11.8µin (0.30µm)
Mated Stacking Heights:	--
Height Above Board:	0.335" (8.50mm)

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< h2 > Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)< /h2 >The 5176381-1 is a rectangular edge board to board, mezzanine type, connector. It offers good mechanical strength and space for providing multiple signals for large circuits. It has two rows that are suitable for mounting on a single board design in soldering process.< h3 > Material and Properties < /h3 >This connector is made from a composed material of 20% phenol, 10% rubber and 70% plastic. It has a current rating of 50 Amps with an insulation between contact points. It also offers good insulation up to 250 Volts. Thanks to its flexible material, the 5176381-1 connector is capable of high-frequency signal contact for up to 5 GHz. Its contact resistance is equal to a maximum 0.2 mΩ and it is RoHS approved.< h3 > Application and working principle < /h3 >The 5176381-1 series of connectors are used in environments where space is a prime factor. It is particularly suitable for applications such as cellular base stations, user friendly equipment, laptop computers and similar complex, high performance applications. The 5176381-1 is also well-suited for board-to-board interconnection, and due to its low cost, makes it a suitable solution for cost-conscious applications.The working principle behind the 5176381-1 is based on a stamped and formed ribbon contact design and rear interfacing. It offers good separation between connecting pairs when the board is in its assembled position. In order to prevent signal loss, the 5176381-1 connector is designed to provide precision and repeatability of signal mating in the I/O pattern at either side of the board. The overall design provides 50-φ pin contacts, each contact being placed in a symmetrical pattern, spaced at 1.2 mm intervals.< h3 > Cleaning and Mounting < /h3 >Before assembly the 5176381-1 connector should be cleaned with an appropriate solvent and a proper lint-free cleaning cloth. After cleaning, the connector should be placed into its mating partner, before applying the proper solder. To ensure reliable contact between mating surfaces is recommended to apply light solder between the contacts.A proper mounting method after assembly helps secure the connector to the motherboard. To ensure the secure attachment of the connector and reliable signal transmission, it is desired to put the connector into position before applying solder. The 5176381-1 can also be applied with snap-in pins, which provides several repeated mounting cycles and protection against shock and vibrations. < h3 > Advantages < /h3 >The 5176381-1 offers several advantages which make it a reliable solution for intricate interconnect environments. It features a robust design which stands up to a variety of harsh environments, while offering precise repeatability. Its material provides superior electrical performance and its 2-level contact design helps protect against signal loss. Its insulation material is up to 250 Volts and it is RoHS approved. The connector can also be used in high-frequency applications, up to 5 GHz. Overall, the 5176381-1 is a reliable solution which offers a wide range of advantages for various interconnect applications. Its various features provides superior electrical performance and protection against signal loss, while remaining cost-effective and offering mechanical strength and board-to-board connections.

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