51915-360LF

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The 51915-360LF is a specialized backplane connector designed to provide reliable connectivity between two boards in a system. It is used in a variety of applications such as rack mounted systems, telecommunications, personal computer components, and networking equipment. The 51915-360LF is a high density connector with contact positions spaced at 0.4mm pitch, allowing for maximum density in a narrow space.

The 51915-360LF is composed of 4 major parts: the plastic housing, the contacts, the transceiver, and the printed circuit board (PCB). The plastic housing is designed to provide a robust and durable base for the connector, while the contacts are responsible for transferring the signals between the upper and lower boards. The transceiver is responsible for converting the signal from the upper to the lower board. Finally, the PCB is designed to provide the electrical connection between the connector and the board.

The 51915-360LF utilizes a contactless transfer system known as the ball-grid array (BGA). This system uses a series of metal balls, arranged in a grid fashion, to transfer signals between the conductive material of the upper and the lower board. The BGA system provides higher contact percentage and allows for higher speeds than the traditional solderless contacts. In addition, the contactless system eliminates the possibility of solder contamination due to shorting. The 51915-360LF can be used in systems operating at data rates up to 10Gbps.

The working principle of the 51915-360LF is based on electromagnetic induction. Each contact has an individual magnet on one side which interacts with the opposite magnet of the other contact. This interaction allows for electrical signals to be sent and received through the contactless system. The transceiver receives the signals from the upper board and converts it to the required signal for the lower board. It then sends the converted signal to the lower board which does the required processing and sends the results back to the upper board.

The 51915-360LF is an ideal connector for high density applications where reliable and high speed data communication is required. The contactless system and high density contacts allow for faster data rates and higher contact percentage than traditional solderless connections, making it an ideal choice for high-performance systems. The plastic housing is designed to provide durability and robustness, while the PCB is designed to ensure reliable electrical connection between the board and the connector.

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