51939-147

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The 51939-147 is a type of backplane connector with specialized features. Backplane connectors are designed for use in equipment chassis or assembly panels, allowing for easy connection of circuit boards or wires. Some backplane connectors feature modular components, allowing for greater adaptability for a variety of interconnect needs. The 51939-147 has a specialized design to suit certain high-density applications.

The 51939-147 is designed to provide a reliable interface between various circuit boards. The connectors have an ultra-low profile and are capable of processing high-speed data signals without sacrificing signal integrity. It features high wire-to-contact ratio, which is desirable in applications that require high-speed data signals due to its ability to reduce signal reflections.

This backplane connector has an innovative latching mechanism that is designed for easy insertion and removal in high-density applications. The contacts feature a wide spring-like cantilever design that ensures a mechanical and electrical connection, improving contact pressure and signal reliability. The contacts are designed with an opening that prevents wire jams and the integrated design is resistant to corrosion and vibration.

The connector also features an innovative solder joint technique that helps ensure a secure connection. The solder joint consists of a series of small Solder fillets between each contact. This helps reduce the contact resistance, ensuring reliable, long-term performance of the assembly. Each contact has also been tested for contact pressure and outgassing to ensure reliable connections.

The 51939-147 offers advanced performance and reliability. It is suitable for applications that require a highly-engineered, specialized solution for high-speed, high-density applications. In addition, the connector has the ability to be configured with various components and accessories for a wide array of applications. The connector is available in a wide range of sizes and is RoHS compliant, making it an ideal choice for applications where environmental responsibility is desired.

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