| Allicdata Part #: | 51939-547LF-ND |
| Manufacturer Part#: |
51939-547LF |
| Price: | $ 1.49 |
| Product Category: | Connectors, Interconnects |
| Manufacturer: | Amphenol FCI |
| Short Description: | R/A HDR POWERBLADE |
| More Detail: | N/A |
| DataSheet: |  51939-547LF Datasheet/PDF |
| Quantity: | 1000 |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| 1188 +: | $ 1.35527 |
Specifications
| Series: | PwrBlade® |
| Packaging: | Tray |
| Lead Free Status / RoHS Status: | -- |
| Part Status: | Active |
| Moisture Sensitivity Level (MSL): | -- |
| Connector Usage: | -- |
| Connector Type: | Header, Male Blades |
| Connector Style: | Blade Power |
| Number of Positions: | 3 |
| Number of Positions Loaded: | 2 |
| Pitch: | 0.100" (2.54mm) |
| Number of Rows: | 1 |
| Number of Columns: | -- |
| Mounting Type: | Board Edge, Through Hole, Right Angle |
| Termination: | Solder |
| Contact Layout, Typical: | 3 Power |
| Features: | Board Lock |
| Contact Finish: | Gold or Gold, GXT™ |
| Contact Finish Thickness: | 30.0µin (0.76µm) |
| Color: | Black |
| Current Rating: | -- |
| Material Flammability Rating: | UL94 V-0 |
| Operating Temperature: | -20°C ~ 105°C |
| Voltage Rating: | -- |
Description
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51939-547LF is the most common type of backplane connectors. It is mainly used in a variety of high performance backplanes, suitable for both auto-sensing applications and skewed wiring. It is capable of transmitting a wide range of signals, such as Ethernet, PCI-Express, USB and PCIe2.0.Backplane connectors are an essential component of any backplane system. They are responsible for directing signals between the device and the board it is connected to. In many types of environments, backplane connectors require detailed consideration due to the high-density boards and other components present, such as the cooling requirements, power supply and connection ports.The 51939-547LF is designed to provide a secure connection between devices and is well suited for applications such as grid computing, cluster computing, computing storage, fiber-optic communications and data replication. The connector is characterized by a variety of features, such as 13.4 mm wide right-angle landings, multi-layer structure, and a high jumper count.The working principle of 51939-547LF is simple and straightforward. It is based on the basic principle of electricity, which states that electrical current travels from a negative to a positive charge. The 51939-547LF makes use of this principle by using a combination of a positive terminal and a negative terminal to transmit the signal.The 51939-547LF has two primary parts: a base and a lead. The base is made from a high-grade plastic that is designed to enable the smooth flow of electrical current and provide a smooth contact area for the lead. The lead is made of copper and is designed to offer a secure connection between the device and the board it is connected to.The working principle of the 51939-547LF is twofold. First, it transmits signals from the device to the board. Second, it provides a physical connection between the device and the board. Signals are transmitted from the device to the board via the lead and physical connections are established by the base. The base ensures the flow of electrical current and ensures a secure and reliable connection between the two components.The 51939-547LF is also designed to provide an optimal level of performance. It is designed with a high jumper count, which enables it to transmit high-speed signals and data transfers. Additionally, the multi-layer structure ensures the highest transmission rates and signal integrity. The advanced design also reduces the time it takes to install and replace the connector.The 51939-547LF is a specialized backplane connector that is used in a variety of high performance backplanes and is suitable for auto-sensing applications and skewed wiring. It is distinguished by an advanced design that offers a secure connection between devices, a high jumper count for high-speed data transfers, and a multi-layer structure for the highest levels of signal integrity.
The specific data is subject to PDF, and the above content is for reference
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