51939-631LF Allicdata Electronics
Allicdata Part #:

51939-631LF-ND

Manufacturer Part#:

51939-631LF

Price: $ 3.33
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: R/A HDR POWERBLADE
More Detail: N/A
DataSheet: 51939-631LF datasheet51939-631LF Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
396 +: $ 3.03178
Stock 1000Can Ship Immediately
$ 3.33
Specifications
Series: PwrBlade®
Packaging: Tray 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Usage: --
Connector Type: Header, Male Pins and Blades
Connector Style: Blade Power
Number of Positions: 28
Number of Positions Loaded: All
Pitch: 0.100" (2.54mm)
Number of Rows: 4
Number of Columns: --
Mounting Type: Board Edge, Through Hole, Right Angle
Termination: Solder
Contact Layout, Typical: 24 Signal, 4 Power
Features: Mating Guide
Contact Finish: Gold or Gold, GXT™
Contact Finish Thickness: 30.0µin (0.76µm)
Color: Black
Current Rating: --
Material Flammability Rating: UL94 V-0
Operating Temperature: -20°C ~ 105°C
Voltage Rating: --
Description

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Backplane Connectors - Specialized

The 51939-631LF is a specialized backplane connector designed for high-speed and high-density applications. It is specifically designed to provide low-profile connection between PCBs in very confined spaces. It is particularly useful in applications requiring high-clock speed, such as memory modules, or complex digital systems, such as field programmable gate arrays (FPGAs).

A backplane connector is a type of electrical connector that is used to connect printed circuit boards (PCB) together. It is typically used in high-performance, mission-critical systems that require consistent and reliable connections. It is similar to a motherboard connector but is smaller and more reliable. This connector can also be used outside the traditional computer-based environment because of its ruggedness and higher performance.

The 51939-631LF has two parts: a dual-row connector and an adapter board. The dual-row connector has two rows of 64 stamped contacts, each contact made from high temperature thermoplastic polyimide (TPI). The contact pitch is 0.08 inch between contacts of the same row and 0.10 inch between contacts of different rows. This allows for a very small, low-profile connection profile. The adapter board has an integral ground-plane that is used for signal shielding and provides a direct path to ground for the signal pins. This board also has two signal switching options: fast geometrical tracing (FGT) and thermal tracing (TT).

FGT is a switching technology that uses a combination of three different methods to switch signals between PCBs. It uses a combination of switching techniques, signal strength changes and optimized geometry to ensure low signal latency and high signal fidelity. TT is a signal switching technology that uses thermal energy to cause the movement of two interconnects on a PCB. The movement causes the signal transmission from one interconnect to the other. TT provides more reliable connections than FGT because it is less susceptible to crosstalk.

The 51939-631LF meets or exceeds all requirements for high-speed, high-density backplane connector applications. It is a versatile connector and is compliant with IEEE 1101.10 and JEDEC MS-11 standards. It is also RoHS compliant, meaning it does not contain any hazardous materials or substances. This connector is well suited for applications that require high levels of performance and reliability, such as telecom, audio/video, networking, military and embedded systems.

The 51939-631LF is designed to provide a low-profile, reliable and consistent connection between PCBs in high-speed, high-density applications. It is robust enough to handle harsh environments but flexible enough to be used in many different applications. The dual-row connector and adapter board provide a slim, low-profile connection profile and the switching options of FGT and TT ensure low signal latency and high signal fidelity.

The specific data is subject to PDF, and the above content is for reference

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