51952-221LF Allicdata Electronics
Allicdata Part #:

51952-221LF-ND

Manufacturer Part#:

51952-221LF

Price: $ 2.91
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: VER HDR POWERBLADE
More Detail: N/A
DataSheet: 51952-221LF datasheet51952-221LF Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
594 +: $ 2.64387
Stock 1000Can Ship Immediately
$ 2.91
Specifications
Series: PwrBlade®
Packaging: Tray 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Usage: --
Connector Type: Header, Male Pins and Blades
Connector Style: Blade Power
Number of Positions: 14
Number of Positions Loaded: All
Pitch: 0.100" (2.54mm)
Number of Rows: 4
Number of Columns: --
Mounting Type: Through Hole
Termination: Solder
Contact Layout, Typical: 12 Signal, 2 Power
Features: Board Lock, Mating Guide
Contact Finish: Gold or Gold, GXT™
Contact Finish Thickness: 30.0µin (0.76µm)
Color: Black
Current Rating: --
Material Flammability Rating: UL94 V-0
Operating Temperature: -20°C ~ 105°C
Voltage Rating: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The 51952-221LF is a specialized backplane connector for board to board connection. This backplane connector is suitable for various applications which demand reliable signal, power transmission, and assured mechanical durability. This backplane connector has several unique features such as Low profile, High speed data, Miniaturization, Rugged design and High-density configurations.

The low profile of the 51952-221LF is achieved by reducing the profile of the area around the pin and the capsule, as well as using a flexible latching system that can be positioned without increasing the overall profile of the backplane connector. This feature allows this backplane connector to be used in applications with limited space or height. Additionally, the high speed data design is very efficient, providing losses and reflections far lower than other backplane connectors. Miniaturization is also present in this backplane connector, as its small design reduces total area used by the system.

The rugged design of the 51952-221LF ensures reliable transmission of signals and powers. It has contact pins made of copper and a copper alloy body, with a temperature range of -45°C to 105°C, which is excellent for some industrial applications. Additionally, the flexible latching system allows the 51952-221LF to withstand significant amounts of vibration and shock. Lastly, its high-density configurations make it an ideal board to board connectivity solution, as it permits the design of high density systems with less waste of space.

As far as its application fields go, the 51952-221LF can be used in various industries, such as IT, medical, automotive, industrial, and aerospace. It is suitable for applications such as industrial control systems, medical instrumentation, cellular base stations, power management, robotics, controllers, and digital signal processing. The 51952-221LF is ideal for these applications due to its robust design and its versatility for low profile, high speed, miniaturization, and high-density configurations.

The working principle of the 51952-221LF is fairly straight forward: a copper alloy shell holds several contact pins, which are held within insulation capsules. The contact pins are then pressed against a matching backplane, and electrical current is transmitted. This backplane connector is designed to isolate the backplane from short circuits and crosstalk, keeping operation safe. The flexible latching system is strong and sturdy, ensuring reliable performance even in cases of shock and vibration.

The 51952-221LF is a specialized backplane connector that is suitable for board to board connections. Its tiny size, robust construction, and versatile features make it suitable for various industry applications, such as industrial control systems, medical instrumentation, cellular base stations, power management, robotics, controllers, and digital signal processing. Additionally, its low profile, high speed data, miniaturization, rugged design, and high-density configurations make it a great option for many applications with specific requirements. Its working principle is relatively simple, with the overall system\'s safety being ensured by the copper alloy shell and insulation capsules.

The specific data is subject to PDF, and the above content is for reference

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