522-13-088-13-062003

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Sockets for ICs, Transistors are used in many electronic applications to serve as an interface for interchangeable components, such as integrated circuits (ICs), transistors, and capacitors. These sockets are designed to work with a range of components, but their primary purpose is to provide an efficient method of connecting and disconnecting components from time to time without interruption.

In particular, the 522-13-088-13-062003 socket was developed for use with dual in-line package (DIP) and surface mount ICs, and is employed in a variety of applications including test benches, communications, instrumentation, and consumer electronics. It is a standard .8" ( 2 cm) width by .3" (8 mm) height, two-row, 14-pin, plastic solder-tail socket, with a maximum current rating of 7.5 A.

The 522-13-088-13-062003 is designed with gold-plated contacts and machined tail pins to reduce contact resistance for improved signal integrity and reliability. It is also constructed with an insulator body to maximise heat dissipation and prevent thermal damage. On this socket, each contact comes with solder-tail pins to enable easy and secure connection with the baseboard during assembly.

The socket features a one-piece, all plastic body and base to ensure a high level of connection reliability and repeatable performance. This socket has been tested and certified to meet or exceed applicable standards such as IEC 6301 and UL 94V-0 Flame Retardant Rating.

The 522-13-088-13-062003 is typically driven by microcontrollers or discrete logic devices, and works by receiving input signals from the driving device and passing them to the attached IC. It then takes the output signals from the attached IC and passes them to the driving device. This socket is also used to connect integrated circuits to other circuits, such as driver or control circuits, to facilitate communication between the two.

The 522-13-088-13-062003 socket is an indispensable component in any embedded system as it not only provides a reliable connection between the attached ICs and other devices, but also helps to protect the components against mechanical shock and environmental contaminants. Furthermore, its low-contact resistance and solder-tail pins ensure reliable performance in a broad range of environments and temperature conditions.

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