523-13-121-13-061002

Sockets for ICs, transistors, and other electronic components are becoming increasingly important for a variety of applications. Their use has become particularly common in high performance electronic device applications, where their interconnection characterizes the electrical performance of the design. In order to meet the ever increasing demands of performance, reliability, and passivation, socket technologies need to offer increased flexibility and scalability.

523-13-121-13-061002 application field and working principle is a type of socket that is used to provide a connection between an integrated circuit (IC) and a printed circuit board. It is designed to make it easy to connect and disconnect ICs during the design phase or in production. This socket features low contact resistance, excellent thermal and vibration resistance, and hysteresis characteristics. It is made of a conductive spring element which is resistant to oxidation and continuous exposure to high temperature.

The mechanism of the socket is based on the spring force contact design where the lower contact is biased against the upper contact by spring loaded plastic mounting clips. The inner contacts are precision stamped from nickel-plated spring steel and are held in precise positions by two rigid plastic housings. This ensures reliable, gas-tight and low contact resistance during operation. In addition, these sockets have an anti-loosening feature, which increases retention force and prevents accidental disconnection due to vibration.

The socket contacts can be easily connected and disconnected with the use of an actuator or the slide feature, which allows insertion and extraction of the chips without the need for special tools. In addition, the socket is compatible with multiple chip sizes and standard pitch sizes. The size of the socket is optimized to yield the best electrical performance with low contact resistance and high signal-to-ground ratio. This socket features an even more robust design with a low inductance in order to minimize capacitive, inductive, and crosstalk signal loss.

523-13-121-13-061002 application field and working principle are widely used in electronic equipment, including computers, PDAs, communicators, digital cameras, and other digital equipment. They are also used in the automotive, medical, microwave/RF, military, and industrial sectors. In these applications, sockets are used to provide a high quality connection between a printed circuit board and an IC. This is important in order to ensure the proper functioning of the device. They are available in a variety of forms, such as ball grid array (BGA) sockets, leadless chip carrier (LCC) sockets, and land grid array (LGA) sockets. These sockets provide low resistance, high speed and excellent signal retention.

Sockets for ICs, transistors, and other electronic components provide an essential function in a variety of applications. In order to ensure that the device operates properly, it is important to select the right type of socket. 523-13-121-13-061002 application field and working principle is a socket that is designed to meet the demands of high performance electronic device applications. It provides reliable connection and excellent thermal and vibration resistance. In addition, it features an even more robust design with a low inductance to minimize capacitive, inductive, and crosstalk signal loss.