5316510-3 Allicdata Electronics
Allicdata Part #:

5316510-3-ND

Manufacturer Part#:

5316510-3

Price: $ 121.50
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: M-ZIF PLUG KIT 260P SOLDER-TYP
More Detail: N/A
DataSheet: 5316510-3 datasheet5316510-3 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
20 +: $ 110.45200
Stock 1000Can Ship Immediately
$ 121.5
Specifications
Series: M
Packaging: Bulk 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Usage: --
Connector Type: Plug, Male Pins
Connector Style: --
Number of Positions: 260
Number of Positions Loaded: All
Pitch: 0.100" (2.54mm)
Number of Rows: 10
Number of Columns: --
Mounting Type: Panel Mount
Termination: Solder
Contact Layout, Typical: --
Features: Actuating Camshaft, Zero Insertion Force (ZIF)
Contact Finish: Gold
Contact Finish Thickness: 50.0µin (1.27µm)
Color: --
Current Rating: 0.8A
Material Flammability Rating: UL94 V-0
Operating Temperature: -55°C ~ 105°C
Voltage Rating: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Backplane connectors are essential components of any industrial network. They are designed to facilitate the transmission of data and power across multiple systems without the use of additional wires or other types of connection. The 5316510-3 backplane connector is a specialized, high-density backplane connector with features that are designed to enhance the overall performance of the system. This article will discuss the application field and working principles of the 5316510-3 Backplane Connector.

Applications Field

The 5316510-3 backplane connector is primarily used in applications that require high frequency, high-density backplane connections. These include telecommunications systems, industrial networks, and general purpose embedded systems. The high-density connection capabilities of the 5316510-3 make it well suited for applications in which space saving is essential. In addition, its high-frequency capabilities also allow for greater signal clarity than could be expected from a standard connector.

Working Principle

The 5316510-3 backplane connector utilizes a high-speed, two-row surface mount contact design. This design consists of two opposing rows of contacts that are spaced closely together. Each contact is rated for up to 1.25A and supports data transfer rates up to 10Gbps. The contacts are also spring loaded, which ensures reliable and secure connections between the contacts.

In order to ensure a reliable and secure connection between the contacts, the 5316510-3 backplane connector utilizes a robust locking mechanism. This mechanism is comprised of two opposing latches that are designed to securely hold the connector in place. Additionally, a specially designed sealing gasket provides additional protection from dust, water, and other environmental contaminants.

The 5316510-3 backplane connector is designed to provide superior signal integrity. It utilizes a low-inductance design, which reduces the amount of signal interference. Additionally, the contacts are coated with a special conductive material that minimizes contact resistance and ensures maximum transfer of data.

Conclusion

The 5316510-3 backplane connector is a specialized, high-density backplane connector that is designed for applications in which space is at a premium and signal integrity is of highest importance. Its two-row surface mount contact design and robust locking mechanism ensure reliable and secure connections between the contacts. Furthermore, its low-inductance design and specially designed conductive material minimize contact resistance and maximize data transfer rate. All in all, the 5316510-3 backplane connector is an excellent choice for applications that require high-speed, high-density connections.

The specific data is subject to PDF, and the above content is for reference

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