Allicdata Part #: | 532-AG10D-ND |
Manufacturer Part#: |
532-AG10D |
Price: | $ 3.87 |
Product Category: | Connectors, Interconnects |
Manufacturer: | TE Connectivity AMP Connectors |
Short Description: | CONN IC DIP SOCKET 32POS GOLD |
More Detail: | N/A |
DataSheet: | 532-AG10D Datasheet/PDF |
Quantity: | 1000 |
375 +: | $ 3.51833 |
Features: | Closed Frame |
Contact Resistance: | -- |
Material Flammability Rating: | UL94 V-0 |
Termination Post Length: | 0.125" (3.18mm) |
Operating Temperature: | -55°C ~ 125°C |
Housing Material: | Polyester |
Contact Material - Post: | Copper Alloy |
Contact Finish Thickness - Post: | 25.0µin (0.63µm) |
Contact Finish - Post: | Gold |
Pitch - Post: | 0.100" (2.54mm) |
Termination: | Solder |
Series: | 500 |
Mounting Type: | Through Hole |
Contact Material - Mating: | Copper Alloy |
Contact Finish Thickness - Mating: | 25.0µin (0.63µm) |
Contact Finish - Mating: | Gold |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions or Pins (Grid): | 32 (2 x 16) |
Type: | DIP, 0.6" (15.24mm) Row Spacing |
Part Status: | Active |
Packaging: | Tube |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Sockets for ICs, transistors, or any other devices, are necessary for providing reliable electrical connections between the electronic components and the electrical circuit board. The 532-AG10D socket is no exception; designed to provide efficient and reliable interconnections with multiple devices. In this article, we will explore the application field and working principle of 532-AG10D socket.
The major application field of 532-AG10D sockets is in the telecoms, consumer electronics and instrumentation industries. Due to the excellent electrical contact capabilities and resistance to corrosion, these sockets are an ideal choice for applications that operate in high vibration, temperature, or challenging environmental conditions. They are also used in applications such as medical electronics, industrial instrumentation, and robotics, which require reliable electrical interconnections over long distances.
The working principle of the 532-AG10D socket can be attributed to several design features. First, the socket features a floating mechanism which compensates the differences in pin spacing between multiple devices. This allows for reliable connections between multiple ICs, transistors, and other devices. The socket also has slots that are specifically designed to provide extended creep paths for the electrical connections between the pins and the PC board. This provides better electrical contact and ensures reliable connections even under extreme voltage and power fluctuations.
In addition to these features, the socket is also designed with a split-line depression that helps maintain contact resistances over long periods of time. The split-line depression also prevents corrosion by providing an extra layer of protection on the terminal connection between the socket and the IC or transistor. The socket also has a self-adjusting contact spring, which adjusts the spring tension according to the type of pin and therefore provides constant pressure on the terminal connection.
Finally, the 532-AG10D socket is designed for easy installation and maintenance. It is an ideal choice for applications that require frequent installation or maintenance cycles. The socket comes with multiple installation options such as through-hole, up-down, surface mount, and right angle. It also has an integrated socket safety cover to protect the contacts from dust or debris. This ensures reliable operation and reduces the risk of electrical shorts.
Overall, 532-AG10D sockets are designed to provide reliable electrical connections between multiple devices and offer multiple installation options. With its floating mechanism, split-line depression and self-adjusting contact spring, the socket is an ideal choice for applications operating in high vibration, temperature, or challenging environmental conditions. It also ensures easy installation and maintenance of multiple ICs, transistors, and other electronic components.
The specific data is subject to PDF, and the above content is for reference
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