533254-1 Allicdata Electronics
Allicdata Part #:

533254-1-ND

Manufacturer Part#:

533254-1

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: HDI PIN ASSY 4 ROW 100 POS
More Detail: N/A
DataSheet: 533254-1 datasheet533254-1 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS non-compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: HDI (High Density Interconnect)
Packaging: Tube 
Lead Free Status / RoHS Status: --
Part Status: Obsolete
Moisture Sensitivity Level (MSL): --
Connector Usage: --
Connector Type: Header, Male Pins
Connector Style: High Density (HDC, HDI, HPC)
Number of Positions: 100
Number of Positions Loaded: All
Pitch: 0.100" (2.54mm)
Number of Rows: 4
Number of Columns: --
Mounting Type: Through Hole
Termination: Press-Fit
Contact Layout, Typical: --
Features: Mating Guide
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Color: Black
Current Rating: --
Material Flammability Rating: UL94 V-0
Operating Temperature: -65°C ~ 125°C
Voltage Rating: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

In the field of electrical technology today, specialized backplane connectors such as 533254-1 are a staple component with numerous uses. Although these interconnects have specialized applications, they offer a variety of advantages over other connection solutions. In this article, we will look at the application field and working principle of the 533254-1 specialized backplane connector.

The 533254-1 connector is designed primarily as a hot-swap interconnect solution. This means that the connector can be quickly and easily removed from the system or replaced without the need to power down the whole system. This allows maintenance or updates to take place while the system remains active, maximizing uptime and productivity. This connector is also used to allow signal and power buses to interconnect two or more individual circuit boards. The 533254-1 offers a high reliability and peak current-carrying capability for ultra-miniature applications.

The 533254-1 connector also features an innovative design with 94 single row, 1.8mm contact pitch and surface-mount contacts. This allows for improved assembly efficiency and assembly optimization, as the connectors are designed to fit into a tight grid pattern. The connector also has straddle-mount options and color-coded keys to ensure a secure fit and proper placement. The 533254-1 is a high-density design that can be used in space-constrained applications, where boards are placed directly on top of each other. This design also offers superior signal quality and reliable performance in the most difficult environments.

The unique design of the 533254-1 allows for improved signal integrity for high speed signals, superior noise immunity, and overall cost reduction due to improved scalability. In addition, the connector\'s low profile design provides a robust connection in compact spaces, minimizing wasted space and allowing for greater design flexibility. The connector can be used in medical, industrial, and other specialized applications.

The 533254-1 utilizes a compression spring-load mechanism to create the electrical connection. This mechanism is designed to create an initial contact force that will keep the contacts from becoming loose or disconnected. The contact force increases over time as the contact force increases, creating a self-securing connection that is stable, strong, and reliable. The combination of materials used in creating the 533254-1 connector adds to its longevity and average lifetime of five million cycles.

The 533254-1 special backplane connector is ideal for applications which require hot-swapping, high speeds, high reliability, as well as ultra-miniature configurations. It provides a cost-effective, reliable, and flexible connection solution for many complex applications and devices.

The specific data is subject to PDF, and the above content is for reference

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