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RF Shields

RF shields are used to protect against electromagnetic interference (EMI) in electronic circuits. They use high-frequency absorbers, which are formed of conductive material combined with a dielectric, to absorb the RF energy, which reduces the level of EMI at the shielding location.

54-CBSA-0.75×2.25×0.5 Application Field and Working Principle

The 54-CBSA-0.75×2.25×0.5 RF shield is a versatile shield, designed for applications where space is limited. It is capable of shielding against frequencies up to 18 GHz. The design utilizes a combination of a conductive and absorptive material to reduce the RF energy and thus reduce the level of EMI at the shielding location.

The shield is constructed of two layers of metal, the innermost layer being conductive, while the outer layer uses a combination of a conductive and absorptive material. The conductive layer blocks the RF energy while the absorptive material reduces the level of EMI further. The design also provides a means of releasing the energy absorbed through ventilation.

The shield also allows for portability, as it can be installed into an existing housing or connected to other components. This makes it an ideal solution for applications where portability is required. Additionally, the shield utilizes a combination of a conductive and absorptive material to reduce the level of electromagnetic interference at the shielding location.

The use of the 54-CBSA-0.75×2.25×0.5 RF shield is particularly useful in applications that require low electromagnetic interference, such as military or aerospace applications. The shield also offers protection in applications where the user needs to maintain a clear line-of-sight for communication or imaging purposes.

The 54-CBSA-0.75×2.25×0.5 RF shield is an effective means for reducing electromagnetic interference in applications where the user needs to maintain a clean signal. It is a versatile shield that is designed to protect against frequencies up to 18 GHz. The shield is constructed of two layers of metal, the innermost layer being conductive, while the outer layer uses a combination of a conductive and absorptive material. The combination of materials helps reduce the EMI produced by the device and helps maintain a clean signal.

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