558-10-356M26-001104 Allicdata Electronics
Allicdata Part #:

558-10-356M26-001104-ND

Manufacturer Part#:

558-10-356M26-001104

Price: $ 79.65
Product Category:

Connectors, Interconnects

Manufacturer: Preci-Dip
Short Description: BGA SURFACE MOUNT 1.27MM
More Detail: N/A
DataSheet: 558-10-356M26-001104 datasheet558-10-356M26-001104 Datasheet/PDF
Quantity: 1000
15 +: $ 71.68000
Stock 1000Can Ship Immediately
$ 79.65
Specifications
Termination: Solder
Contact Resistance: 10 mOhm
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.086" (2.20mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: FR4 Epoxy Glass
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.050" (1.27mm)
Series: 558
Features: Closed Frame
Mounting Type: Surface Mount
Contact Material - Mating: Brass
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Number of Positions or Pins (Grid): 356 (26 x 26)
Type: BGA
Part Status: Active
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

558-10-356M26-001104 is a type of socket designed for integrated circuit packages, transistors, and other similar devices that require special cases. This allows for improved heat transfer from the chip or device to the printed circuit board. It is typically used in the automotive, military, and aerospace industries to reduce costs and reduce the overall size of the system.

The socket is designed in such a way that it has two major components – a socket component and a spring component. The socket component is made up of a dielectric material with a conductive metal base, which is used to connect the socket to the board. The spring component is made of a flexible material such as rubber or silicone, designed to provide the necessary contact force. The combination of the two components creates a system that provides excellent contact and heat transfer.

The 558-10-356M26-001104 socket is simple in its working principle, which is why it is so popular. It uses mechanical force to create contact between the socket and the board. The socket component is placed directly over the component and the spring component presses against it. This creates an electrical connection between the socket and the component, allowing signals to pass between them.

The socket is mainly used to interface with electronic components such as CPUs, memory, FPGAs, PLDs, and ASICs. The socket also provides excellent protection against environmental conditions such as vibrations, shocks, humidity, and moisture. In addition, it is designed to provide reliable and stable electrical connections while consuming minimal power.

The 558-10-356M26-001104 socket is highly reliable and has a wide range of applications. It is commonly used in the automotive, military, aerospace, and robotics industries. This socket is designed to support a variety of devices, including Intel® CPUs, Volta® GPUs, AMD® GPUs, and Intel® Xeon® processors. It is also suitable for connection to high-speed memory modules and displays.

In addition, the 558-10-356M26-001104 socket comes with IP67 rated connector protection, which provides superior water and dust resistance. It is designed to meet the needs of the most demanding applications, including systems with high data transfer rates, high power requirements, and high vibration levels.

The 558-10-356M26-001104 socket is a highly reliable and versatile socket with a wide range of applications and uses. It is designed to provide excellent contact and heat transfer, while also reducing costs and size requirements. It is perfect for connecting electronic components and providing reliable and stable electrical connections while consuming minimal power.

The specific data is subject to PDF, and the above content is for reference

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