558-10-357M19-001101 Allicdata Electronics
Allicdata Part #:

558-10-357M19-001101-ND

Manufacturer Part#:

558-10-357M19-001101

Price: $ 75.21
Product Category:

Connectors, Interconnects

Manufacturer: Preci-Dip
Short Description: PGA SOLDER TAIL 1.27MM
More Detail: N/A
DataSheet: 558-10-357M19-001101 datasheet558-10-357M19-001101 Datasheet/PDF
Quantity: 1000
21 +: $ 67.68660
Stock 1000Can Ship Immediately
$ 75.21
Specifications
Termination: Solder
Contact Resistance: 10 mOhm
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.111" (2.83mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: FR4 Epoxy Glass
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.050" (1.27mm)
Series: 558
Features: Closed Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Number of Positions or Pins (Grid): 357 (19 x 19)
Type: PGA
Part Status: Active
Packaging: Bulk 
Description

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558-10-357M19-001101 Application Field and Working Principle

Socket 558-10-357M19-001101 is an integrated circuit (IC) socket. It is typically used to drop in a dual inline package (DIP) IC to establish a connection to the mother board. It features a flat, open contact wiping bus bar and is ideal for applications where cost savings and maximum current carrying capacity are required. The socket offers a full size soldering/welding connection points for all terminals and can be used with a wide variety of ICs.

Overview

Socket 558-10-357M19-001101 is a common socket used in many digital electronic devices. It\'s compatible with 8, 14, or 16 pin DIP ICs. It\'s typically sold with leads that are pre-formed in a radially outward fashion. This allows for a quick connection to the mother board since the leads don\'t have to be soldered.

Working Principle

The socket is arranged as a two dimensional, linear "matrix" of interconnected contact points. It has a flat, open contact wiping bus bar which connects all of the contact points and allows for reliable interconnectivity. The whole socket is enclosed in a protective case. The case is usually made from plastic or some other non-conductive polymer, which prevents electrical shorts and protects the socket from dust or moisture.

The contact points on the socket are designed to give a firm yet flexible grip to the IC pins, allowing them to make contact and maintain a reliable connection. The contact points have a bevelled shape which ensures a good, secure connection between the IC pins and the socket. In order to make the connection a dual inline package (DIP) IC is pushed into the socket, and the contact points grip the pins and hold them in place.

Applications

Socket 558-10-357M19-001101 is commonly used in PCBs for embedded systems, industrial applications, telecommunications, medical devices, and consumer electronics. It is also used in automotive, aerospace, and military applications. The socket is designed to work with a wide variety of integrated circuits (ICs).

Conclusion

Socket 558-10-357M19-001101 is a popular socket used in many digital electronic devices. It is used to connect integrated circuits (ICs) to the mother board. The socket has a flat, open contact wiping bar which establishes a reliable connection between the ICs and the mother board. It is used for a variety of applications in industries such as automotive, aerospace, telecommunication, and consumer electronics.

The specific data is subject to PDF, and the above content is for reference

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