| Allicdata Part #: | 558-10-357M19-001101-ND |
| Manufacturer Part#: |
558-10-357M19-001101 |
| Price: | $ 75.21 |
| Product Category: | Connectors, Interconnects |
| Manufacturer: | Preci-Dip |
| Short Description: | PGA SOLDER TAIL 1.27MM |
| More Detail: | N/A |
| DataSheet: | 558-10-357M19-001101 Datasheet/PDF |
| Quantity: | 1000 |
| 21 +: | $ 67.68660 |
| Termination: | Solder |
| Contact Resistance: | 10 mOhm |
| Current Rating: | 1A |
| Material Flammability Rating: | UL94 V-0 |
| Termination Post Length: | 0.111" (2.83mm) |
| Operating Temperature: | -55°C ~ 125°C |
| Housing Material: | FR4 Epoxy Glass |
| Contact Material - Post: | Brass |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Finish - Post: | Gold |
| Pitch - Post: | 0.050" (1.27mm) |
| Series: | 558 |
| Features: | Closed Frame |
| Mounting Type: | Through Hole |
| Contact Material - Mating: | Beryllium Copper |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Finish - Mating: | Gold |
| Pitch - Mating: | 0.050" (1.27mm) |
| Number of Positions or Pins (Grid): | 357 (19 x 19) |
| Type: | PGA |
| Part Status: | Active |
| Packaging: | Bulk |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
558-10-357M19-001101 Application Field and Working Principle
Socket 558-10-357M19-001101 is an integrated circuit (IC) socket. It is typically used to drop in a dual inline package (DIP) IC to establish a connection to the mother board. It features a flat, open contact wiping bus bar and is ideal for applications where cost savings and maximum current carrying capacity are required. The socket offers a full size soldering/welding connection points for all terminals and can be used with a wide variety of ICs.
Overview
Socket 558-10-357M19-001101 is a common socket used in many digital electronic devices. It\'s compatible with 8, 14, or 16 pin DIP ICs. It\'s typically sold with leads that are pre-formed in a radially outward fashion. This allows for a quick connection to the mother board since the leads don\'t have to be soldered.
Working Principle
The socket is arranged as a two dimensional, linear "matrix" of interconnected contact points. It has a flat, open contact wiping bus bar which connects all of the contact points and allows for reliable interconnectivity. The whole socket is enclosed in a protective case. The case is usually made from plastic or some other non-conductive polymer, which prevents electrical shorts and protects the socket from dust or moisture.
The contact points on the socket are designed to give a firm yet flexible grip to the IC pins, allowing them to make contact and maintain a reliable connection. The contact points have a bevelled shape which ensures a good, secure connection between the IC pins and the socket. In order to make the connection a dual inline package (DIP) IC is pushed into the socket, and the contact points grip the pins and hold them in place.
Applications
Socket 558-10-357M19-001101 is commonly used in PCBs for embedded systems, industrial applications, telecommunications, medical devices, and consumer electronics. It is also used in automotive, aerospace, and military applications. The socket is designed to work with a wide variety of integrated circuits (ICs).
Conclusion
Socket 558-10-357M19-001101 is a popular socket used in many digital electronic devices. It is used to connect integrated circuits (ICs) to the mother board. The socket has a flat, open contact wiping bar which establishes a reliable connection between the ICs and the mother board. It is used for a variety of applications in industries such as automotive, aerospace, telecommunication, and consumer electronics.
The specific data is subject to PDF, and the above content is for reference
CONN SOCKET PGA GOLD
CONN IC DIP SOCKET ZIF 28POS TIN
CONNECTOR
CONN SOCKET LGA 1356LGA GOLD
CONN CAMERA SOCKET 32POS GOLD
CONN SOCKET TRANSIST TO-5 4POS
558-10-357M19-001101 Datasheet/PDF