| Allicdata Part #: | 558-10-388M26-001104-ND |
| Manufacturer Part#: |
558-10-388M26-001104 |
| Price: | $ 86.81 |
| Product Category: | Connectors, Interconnects |
| Manufacturer: | Preci-Dip |
| Short Description: | BGA SURFACE MOUNT 1.27MM |
| More Detail: | N/A |
| DataSheet: |  558-10-388M26-001104 Datasheet/PDF |
| Quantity: | 1000 |
| 15 +: | $ 78.12280 |
| Termination: | Solder |
| Contact Resistance: | 10 mOhm |
| Current Rating: | 1A |
| Material Flammability Rating: | UL94 V-0 |
| Termination Post Length: | 0.086" (2.20mm) |
| Operating Temperature: | -55°C ~ 125°C |
| Housing Material: | FR4 Epoxy Glass |
| Contact Material - Post: | Brass |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Finish - Post: | Gold |
| Pitch - Post: | 0.050" (1.27mm) |
| Series: | 558 |
| Features: | Closed Frame |
| Mounting Type: | Surface Mount |
| Contact Material - Mating: | Brass |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Finish - Mating: | Gold |
| Pitch - Mating: | 0.050" (1.27mm) |
| Number of Positions or Pins (Grid): | 388 (26 x 26) |
| Type: | BGA |
| Part Status: | Active |
| Packaging: | Bulk |
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Sockets for ICs, Transistors
Sockets are mechanical devices used to hold, an integrated circuit (IC) in place for testing and/or manufacture. Socketing ICs and transistors allows for their easy replacement in the event they are damaged, without having to worry about additional reworks. The 558-10-388M26-001104 is a specialized socket used for transistors and ICs.
Application Field
The 558-10-388M26-001104 socket is designed for use with RF surface mount devices, such as transistors and FETs. It is typically used to control impedance in densely packed circuits. The socket is also tested to EIA standards for frequency and impedance, making it an ideal choice for use in on-board RF applications. In addition, because of its small size and light weight, it can be used in compact, handheld electronics.
Working Principle
The 558-10-388M26-001104 socket works by providing a secure, conductive pathway between the IC and/or transistor and the circuit board. It is designed to hold the device in place with a sprung contact mount, ensuring it makes positive contact. This ensures all the appropriate current flows in the right direction and no voltage is lost, or ‘dropped’ due to contact with imperfections in the circuit board.
When plugged in, the socket mechanism makes contact with the circuitry and solder points, providing a device-level connection between the IC and/or transistor and circuit board. Additionally, the socket uses a friction fit heat sink and gold plated contacts to provide better thermal performance and improved signal transmission. This reduces the effect of errors caused by temperature variations.
Conclusion
The 558-10-388M26-001104 socket is a specialized device designed for transistors and ICs, providing a secure connector for impedance control in densely packed circuits. It offers superior electrical and thermal performance by using an improved heat sink and gold plated contacts, giving better signal transmission and reducing the risk of errors. This makes the 558-10-388M26-001104 an ideal choice for use in on-board RF applications, as well as applications with compact, handheld electronics.
The specific data is subject to PDF, and the above content is for reference
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