558-10-478M26-131101

Series:	558
Packaging:	Bulk
Part Status:	Active
Type:	PGA
Number of Positions or Pins (Grid):	478 (26 x 26)
Pitch - Mating:	0.050" (1.27mm)
Contact Finish - Mating:	Gold
Contact Finish Thickness - Mating:	10.0µin (0.25µm)
Contact Material - Mating:	Beryllium Copper
Mounting Type:	Through Hole
Features:	Open Frame
Termination:	Solder
Pitch - Post:	0.050" (1.27mm)
Contact Finish - Post:	Gold
Contact Finish Thickness - Post:	10.0µin (0.25µm)
Contact Material - Post:	Brass
Housing Material:	FR4 Epoxy Glass
Operating Temperature:	-55°C ~ 125°C
Termination Post Length:	0.111" (2.83mm)
Material Flammability Rating:	UL94 V-0
Current Rating:	1A
Contact Resistance:	10 mOhm

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Sockets for ICs, Transistors

Integrated Circuits (ICs) and transistors are important components in electrical circuit design. They have been used in numerous applications, from consumer electronics to medical, automotive and aerospace industries. In order to properly use these components in an electrical circuit, they must be connected with the appropriate socket. Recently, 558-10-478M26-131101 socket has become popular amongst circuit designers due to its many advantages over other socket types. This article will explore the application field and working principle of the 558-10-478M26-131101 socket.The 558-10-478M26-131101 is a versatile socket type designed for various applications. It is specifically designed to support a wide range of ICs and transistors, making it an ideal choice for many projects. The socket features two rows of pin contacts that are spaced three millimeters apart, allowing it to accommodate larger ICs and transistors, as well as their smaller counterparts. It is also designed with a standard pin pattern, ensuring compatibility with most modern test instruments and breaking boards. Additionally, the socket is constructed from high-grade materials, providing excellent electrical and thermal performance.The 558-10-478M26-131101 socket can be used in a variety of applications, such as microcontroller development, prototyping, and general testing of transistors and ICs. It is also suitable for use in Radio Frequency (RF) design and simulation, as well as in Production Line Testing (PLT) and EMC testing. Furthermore, the socket can be used in embedded systems, such as those found in automobiles, medical equipment and aerospace components. Finally, the socket is designed to fit in standard breadboards for easy incorporation in prototyping tasks.In terms of working principles, the 558-10-478M26-131101 socket serves as a simple connection point between the circuit components and the board. To use it, components are inserted into the socket and electrical contact is achieved when the pins make contact with the metal strip inside it, allowing electrical current to be transferred between the two. The socket is also designed with a self-locking feature, preventing the components from loosening during operation.In addition to the above functionalities, the 558-10-478M26-131101 socket provides additional advantages that make it an attractive choice for many applications. It features an optional heatsink that can be used to disperse heat generated from the components, ensuring they remain at the optimal temperature. Also, the socket is designed with gold-plated contacts that provide superior electrical conductivity and increased reliability. Furthermore, the socket is designed with a dust-resistant seal, enabling it to protect the components from foreign objects, such as rust and dirt.Ultimately, the 558-10-478M26-131101 socket is a reliable socket type that provides numerous advantages and is suitable for a variety of applications. Boasting a standard pin pattern and gold-plated contacts, this socket provides reliable electrical contact and superior conductivity of heat. Its optional heatsink reduces any heat generated from the components and its dust-resistant seal prevents foreign objects from entering the socket. As such, it is an ideal choice for prototyping, microcontroller development, RF design and simulation.

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