61082-164606LF

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The 61082-164606LF from Samtec are high speed, mezzanine board-to-board connectors. The 61082-164606LF is typically used for data communication in computer and communication equipment and has been designed for use in a variety of applications including industrial, computer, communications and consumer/appliance markets.

The 61082-164606LF is a zero-insertion force (ZIF) mezzanine connector system. It features a robust design offering low power & thermal losses, improved signal integrity, lower costs, and reduced cycle times. It can be used for stacking and parallel board connections, as well as mating between different board heights and sizes and for high-speed signal transmission between boards. The 61082-164606LF includes a wide variety of mezzanine connector families such as the HF6 and F7 Series for connecting different boards at varying heights, and the ULF, UF, and UJ Series for stacking boards together.

Functionally, the 61082-164606LF has been designed for applications requiring high-speed transmission using differential signaling. It uses signal contacts on both the top and bottom to provide good electrical performance by reducing crosstalk, EMI, and ground bounces. The 61082-164606LF offers solder tabs for board to board connections. The system utilizes a range of latch retention styles to secure the connector in place.

The 61082-164606LF is a rectangular array, edge type, mezzanine connector with five rows of 40 positions and a pitch of 0.5mm. This connector is available in a range of different materials including copper alloy, stainless steel, and black zinc plated brass. It is rated for operating temperatures between -55 and +125°C, an operating voltage of 10V, and an operating current of 0.5 Amps. The 61082-164606LF meets IP-20 and RoHS compliances.

The 61082-164606LF is designed to provide robust performance while increasing controllability in a wide range of applications. With its compact design, multiple signal contact points, and robust latch retention styles, it\'s suitable for high-speed signal transmission and can be used to make reliable connections between different board heights and sizes. It is therefore an ideal solution for applications requiring reliable connections between boards.

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