61083-044409LF

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The 61083-044409LF is a rectangular connector array that is edge type, mezzanine-board, and fixed. This multi-pin connector is ideal for certain applications, such as mounting a module onto a card or as a core component in a system. It is designed for use in high speed data communication, network, and storage, and is capable of supporting up to 5.3 Gbps data transfer speed. This product is a perfect solution for applications where high speed communication with small form factor are needed.

The 61083-044409LF rectangular connector array is crafted with board-to-board packaging and simple to install. It is designed with specific requirements and user-friendly configurations. This product seals against exposure to solid particles, such as dust, water solder-flux, and other contaminants. It offers excellent resistance to both mechanical and chemical stress. Furthermore, a short circuit condition is prevented between adjacent pins and the entire well system when exposed to high current levels.

The 61083-044409LF molded with thermoplastic overmold provide secure connections and reliable performance. With a combination of soldermask and the edge-type connectors, it is designed to make reliable contacts in limited space. The soldermask has a 0.8-mm pitch and is designed for insertion reliability. It is also designed with a high-temperature thermoplastic housing that stands up against temperatures up to 130°C.

The 61083-044409LF offers a cost-effective and reliable connection that is ideal for applications involving high speeds and small form factors. Its 0.8-mm pitch and board-to-board packaging make it suitable for tight assembly requirements. It also has a thermoplastic overmold that stands up against high temperatures. It is also designed with soldermask that provides exceptionally reliable contacts in limited space.

The 61083-044409LF multi-pin, edge-type connector is a reliable and cost-effective solution for applications involving high speed and small form factors. Its soldermask gives exceptional insertion reliability, while its thermoplastic overmold offers superior resistance to mechanical and chemical stress. Its board-to-board packaging gives secure connections and the 0.8-mm pitch provides for insertion reliability. This product is designed for high-speed data communication, network, and storage applications where miniaturization is needed. It is a great solution for applications requiring secure, reliable connections between small form factor components.

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