612-83-952-41-001101 Allicdata Electronics
Allicdata Part #:

612-83-952-41-001101-ND

Manufacturer Part#:

612-83-952-41-001101

Price: $ 2.84
Product Category:

Connectors, Interconnects

Manufacturer: Preci-Dip
Short Description: CONN IC DIP SOCKET 52POS GOLD
More Detail: N/A
DataSheet: 612-83-952-41-001101 datasheet612-83-952-41-001101 Datasheet/PDF
Quantity: 1000
196 +: $ 2.58387
Stock 1000Can Ship Immediately
$ 2.84
Specifications
Termination: Solder
Contact Resistance: 10 mOhm
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.291" (7.39mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: --
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: 612
Features: Carrier, Open Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 52 (2 x 26)
Type: DIP, 0.9" (22.86mm) Row Spacing
Part Status: Active
Packaging: Bulk 
Description

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Sockets for ICs, transistors, and other electronic components provide a convenient means of connecting multiple devices together. The 612-83-952-41-001101 socket is specifically designed to provide connection for low-power integrated circuits such as digital logic, memory chips, and microprocessors.

   

Uses of 612-83-952-41-001101 Socket

   

       The 612-83-952-41-001101 socket is mainly used for low-power integrated circuits due to its design. It is capable of handling a wide variety of digital logic chips, memory chips, and microprocessors. It is ideal for situations where multiple devices need to be connected together, such as an embedded system or a processor-driven electronic device.

       

Design of 612-83-952-41-001101 Socket

   

       The 612-83-952-41-001101 socket is a square-shaped socket constructed from a plastic/rubber material, with contacts placed near each corner of the socket. These contacts are made of copper plated material, and are spaced specifically for providing reliable electrical connections when used with low-power integrated circuits. This socket is rated up to 25mA, which is sufficient for handling the majority of digital logic chips, memory chips, and microprocessors.

   

Application of 612-83-952-41-001101 Socket

   

       The 612-83-952-41-001101 socket is widely used in embedded system applications. It is used to provide a reliable connection between multiple digital logic chips or microprocessors. It is also used to provide a connection between a processor and memory chip in devices such as a cell phone or a computer. The 612-83-952-41-001101 socket is also suitable for connecting other low-power integrated circuits such as timers, audio chips, and oscillators.

   

Working Principle

   

       The 612-83-952-41-001101 socket is designed to provide a reliable electrical connection between two devices via its contacts. When an IC is placed in the socket, the contacts make contact with the pins on the IC. This contact is then used to transfer electrical signals between the two devices. The copper-plated contacts provide a low-resistance connection, which is necessary for ensuring a reliable electrical flow. Additionally, the socket is designed to protect the IC from static electricity and other damage caused by external factors.

   

Conclusion

   

       The 612-83-952-41-001101 socket is a highly reliable and versatile socket designed specifically for low-power integrated circuits. It is ideal for connecting multiple digital logic chips, memory chips, and microprocessors, and is suitable for a wide variety of embedded system applications. Its reliable contacts provide a low-resistance connection for transferring electrical signals, and its design protects the IC from static electricity and other damage. Overall, the 612-83-952-41-001101 socket is an excellent choice for providing reliable connections between multiple devices.

The specific data is subject to PDF, and the above content is for reference

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