68-537-20 Connectors, Interconnects |
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Allicdata Part #: | A337-ND |
Manufacturer Part#: |
68-537-20 |
Price: | $ 9.64 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Aries Electronics |
Short Description: | CONN SCKT INSERT PLATE FOR PLCC |
More Detail: | Connector Insert Plate For PLCC Sockets |
DataSheet: | 68-537-20 Datasheet/PDF |
Quantity: | 1000 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
7 +: | $ 8.76057 |
Series: | 537 |
Packaging: | Bulk |
Lead Free Status / RoHS Status: | -- |
Part Status: | Active |
Moisture Sensitivity Level (MSL): | -- |
Accessory Type: | Insert Plate |
For Use With/Related Products: | PLCC Sockets |
Number of Pins: | 68 |
Body Material: | Polyphenylene Sulfide (PPS), Glass Filled |
Body Finish: | -- |
Color: | Black |
Features: | -- |
Material Flammability Rating: | UL94 V-0 |
Operating Temperature: | -65°C ~ 260°C |
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Sockets for ICs, Transistors - Accessories:
The 68-537-20 Socket is a unique type of computer component to allow for the assembly and connection of different components with on board or external computer components through a standardized design. This socket type is utilized extensively in both commercial and consumer electronics applications. As sockets for ICs and transistors are known to be expensive with their complex designs, 68-537-20 makes them affordable, reliable and operational for different kinds of applications.
The 68-537-20 socket is composed of two parts; the die that provides the electrical connection between components, and the base which secures the die in place. The 65nm die is designed to be snapped into the socket housing, while the base is designed to withstand the temperature and pressure involved in electron transfer. Together, these two components allow for the assembly of a reliable connection between the socket and the electronic component. Furthermore, the base also provides protection for the die from physical shock, dust, and other external elements.
Generally, the 68-537-20 socket is applied for applications that require a small-matrix type connection. This socket type is also commonly used in consumer electronics, such as laptops, cellular phones, and digital cameras. This socket type is also used for industrial applications, such as in air conditioning systems, automated production systems, and machine tools.
The typical 68-537-20 socket has four pins. The four pins represent the connections between the die, which are transmitted between the two components. These pins are make connection links of up to 1 Amp with the rating of 1.5 volts. These pins may be used to support different components, such as transistors, integrated circuits, and other electronic devices.
The working principle of the 68-537-20 socket is through electron flow current. The connection between the die and the base is established when an electronic component, like an integrated circuit, is inserted into the socket. The current creates a charging effect in the two components, with electrons moving across the metal contacts of the die and conducting current through the metal pins of the base. This process is known as “thermoelectricity effect”, which is a form of direct current alternation.
The 68-537-20 socket is constructed from plastic and metal components, such as copper and gold. These metals add certain levels of conductivity to the socket material, which is necessary for the electrical transfer of electrons. The socket also includes various forms of protection for the die and the base. These include dust covers, pads used to stiffen the contact, and clips to help secure the base to the die.
In summary, the 68-537-20 socket is a discontinued electronic component designed to allow for the assembly and connection of different types of electronic components with or without an onboard computer component. This socket type is applied widely in commercial and consumer electronics applications and is known for its durable design. This socket type works through the thermoelectricity effect, allowing electrons to flow between two components to create a charge.
The specific data is subject to PDF, and the above content is for reference
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