68-PLS11033-12 Allicdata Electronics
Allicdata Part #:

68-PLS11033-12-ND

Manufacturer Part#:

68-PLS11033-12

Price: $ 33.86
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN SOCKET PGA ZIF GOLD
More Detail: N/A
DataSheet: 68-PLS11033-12 datasheet68-PLS11033-12 Datasheet/PDF
Quantity: 1000
2 +: $ 30.47310
Stock 1000Can Ship Immediately
$ 33.86
Specifications
Termination: Solder
Contact Resistance: --
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: -65°C ~ 125°C
Housing Material: Polyphenylene Sulfide (PPS)
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: PLS
Features: Closed Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): --
Type: PGA, ZIF (ZIP)
Part Status: Active
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The 68-PLS11033-12 is a component of sockets for ICs, transistors, and other small parts. This upgraded version of the original PLS sockets provides greater convenience and reliability when connecting integrated circuits with a variety of terminal connections. The 68-PLS11033-12 is a socket with wide application field and stable working principle for high-speed ICs. It has more reliable pin-to-socket contact, high contact reliability, superior confidentiality, and a steady current carrying capacity when compared to other sockets.

In terms of applications, the 68-PLS11033-12 is widely used to connect groups of integrated circuits and other small electronic parts such as transistors, microcontrollers, and SRAMs. It is suitable for the environment where temperature is between -55℃ and 150 ℃. The 68-PLS11033-12 is also popular in high-speed analog signal transmission applications, and can be used in high-density mount layouts. In addition, this socket is also used in the semiconductor test & burn-in equipment and device production, testing, and maintenance applications.

In terms of working principle, the 68-PLS11033-12 adopts both pressure and tin-plated contact. To connect integrated circuits and other small components, the 68-PLS11033-12 requires two main steps. First, a spring is used to press the terminal on the integrated circuit and the contacts of the socket together. Then, a tin-plated layer is applied on the contact area which makes the connection secure and reliable.

Moreover, the 68-PLS11033-12 provides great stability when compared to other sockets. This is achieved by its increased number of pins and a low DCR. The 68-PLS11033-12 also has a stronger contact force, more reliable pin-to-socket contacts and better current carrying capacity. Furthermore, it is designed with a high-temperature terminal which promises a secure and reliable connection in a broad temperature range.

All in all, the 68-PLS11033-12 offers a great alternative to traditional sockets for ICs, transistors, and other small components. It is widely used in high speed analog signal transmission, and has features such as increased pin number, low DCR and strong contact force. With its pressure contact and tin-plating, the 68-PLS11033-12 is able to protect the connected integrated circuits and other parts from excessive current, high temperatures and other environmental impacts.

The specific data is subject to PDF, and the above content is for reference

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