Insulation Color:	Black
Contact Finish Thickness - Post:	100.0µin (2.54µm)
Contact Material:	Phosphor Bronze
Contact Shape:	Square
Insulation Material:	Polyphenylene Sulfide (PPS), Glass Filled
Applications:	Automotive, General Purpose, Industrial, Telecommunications
Voltage Rating:	--
Current Rating:	--
Features:	Board Lock
Ingress Protection:	--
Mated Stacking Heights:	--
Contact Finish - Post:	Tin
Material Flammability Rating:	UL94 V-0
Operating Temperature:	--
Contact Length - Post:	--
Insulation Height:	0.310" (7.87mm)
Series:	Dubox™
Contact Finish Thickness - Mating:	30.0µin (0.76µm)
Contact Finish - Mating:	Gold or Gold, GXT™
Fastening Type:	Push-Pull
Termination:	Solder
Mounting Type:	Surface Mount
Row Spacing - Mating:	--
Number of Rows:	1
Pitch - Mating:	0.100" (2.54mm)
Number of Positions Loaded:	All
Number of Positions:	8
Style:	Board to Board
Contact Type:	Female Socket
Connector Type:	Receptacle
Part Status:	Active
Packaging:	Tube

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Rectangular Connectors - Headers, Receptacles, Female Sockets

68617-608LF Application Field and Working Principle

The 68617-608LF is a low-profile, RF-grade surface-mount receptacle from the Samtec VSF line of components. It is used for board-to-board, wire-to-board, and coax interconnections. It is designed to fit in tight spaces and features VSF technology which ensures a robust, high-performance connection.This device is ideal for applications where space is limited, such as cellular phones, laptops and tablet computers. The 68617-608LF offers a reliable connection with low levels of insertion force. It features two rows of 8 contact receptacles on 0.100" (2.54mm) centers. Each contact is rated for a maximum of 5A and an operating temperature range of -55 to +125°C.The device utilizes a simple, one-piece construction with a double-beam contact design. Each contact has a unique design that offers superior retention force and superior electrical performance. The contact receptacles are made from pre-plated copper alloy and feature a gold-plated contact interface.The 68617-608LF is designed to be used with Samtec’s 68617-123X RF PCB headers. When the two components are mated, they form a robust, low profile connection that is designed to provide reliable RF performance. The device also features an anti-snag design that prevents the header and receptacle from separating.When the components are mated, the electrical connection is completed via an internal RF coax. In order to ensure a reliable connection, the coax must be properly inserted into the device and the ends must be properly aligned and connected. This ensures that the RF signal is properly transmitted through the connection.The 68617-608LF is a versatile device that can be used in a variety of applications. It is suitable for a wide range of frequencies and is compatible with various technologies, such as LTE and 5G. The device is RoHS compliant and UL recognized, ensuring a safe and reliable connection.In conclusion, the 68617-608LF is a high-performance, low-profile, RF-grade receptacle from the Samtec VSF line of components. It is designed to provide reliable board-to-board, wire-to-board, and coax connections under limited space conditions. The device features a unique contact design that offers superior retention force and superior electrical performance. It is suitable for a variety of applications and is compatible with various technologies.

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