714-43-226-31-007000 Allicdata Electronics
Allicdata Part #:

714-43-226-31-007000-ND

Manufacturer Part#:

714-43-226-31-007000

Price: $ 9.98
Product Category:

Connectors, Interconnects

Manufacturer: Mill-Max Manufacturing Corp.
Short Description: CONN SKT SNG
More Detail: 26 Position Receptacle Connector Through Hole
DataSheet: 714-43-226-31-007000 datasheet714-43-226-31-007000 Datasheet/PDF
Quantity: 1000
50 +: $ 8.98681
Stock 1000Can Ship Immediately
$ 9.98
Specifications
Insulation Color: Black
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material: Beryllium Copper
Contact Shape: Circular
Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Applications: --
Voltage Rating: --
Current Rating: 3A
Features: Carrier
Ingress Protection: --
Mated Stacking Heights: --
Contact Finish - Post: Tin
Material Flammability Rating: --
Operating Temperature: -55°C ~ 125°C
Contact Length - Post: 0.115" (2.92mm)
Insulation Height: --
Series: 714
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Fastening Type: Push-Pull
Termination: Solder
Mounting Type: Through Hole
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Pitch - Mating: 0.100" (2.54mm)
Number of Positions Loaded: All
Number of Positions: 26
Style: Board to Board
Contact Type: Female Socket
Connector Type: Receptacle
Part Status: Active
Packaging: Bulk 
Description

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Sockets for ICs, Transistors are used to mechanically and electrically connect ICs, transistors and other components to printed circuit boards. The 714-43-226-31-007000 application field and working principle is an example of a socket for ICs, transistors. This socket is designed for Quad Flat No-Lead (QFN) packages, and can accept a wide range of leadless chip carriers with a pitch range of 0.4–.48mm, and has a lead hole diameter of 0.085–0.38 inch. This socket is made up of multiple components including an integrated, flexible \'zero insertion force\' (ZIF) socket base, four spring loaded pins, and a spring cap which serves to secure the contact pins.The 714-43-226-31-007000 application field and working principle has been designed to reduce the insertion, removal and re-insertion forces of ICs, transistors, thin-film transistors, resistors, capacitors and other SM parts. It is used to securely solder QFN packages to circuit boards, and to create an optimal connection between those components and the circuit board. When the socket is installed and in use, the spring cap keeps the pins secure and reduces the risk of component mechanical damage. The base has pre-loaded contacts which provide a low-resistance electrical connection. The contact area is made up of a socket base made up of two layers; an inner layer made of beryllium copper, and an outer layer of phosphor bronze. The outer layer is plated with a gold layer to reduce oxidation and improve durability.The 714-43-226-31-007000 application field and working principle is manufactured to meet MIL-STD-883 and is RoHS compliant. This socket also makes use of a self-aligning mechanism, which ensures that the component is level when mounted in the socket. This socket is designed to minimize contact resistance and thermal resistance, ensuring that components are securely connected and that heat is dispersed effectively.The 714-43-226-31-007000 application field and working principle is a reliable and durable socket for ICs, transistors and many other components. This socket can support a wide range of parts, and its low-resistance contacts, durable construction and robust spring-loaded contact system make it the ideal choice for securely connecting and soldering components to circuit boards.

The specific data is subject to PDF, and the above content is for reference

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