Allicdata Part #: | 75867-309LF-ND |
Manufacturer Part#: |
75867-309LF |
Price: | $ 1.75 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Amphenol FCI |
Short Description: | CONN HEADER 60POS DUAL R/A PCB |
More Detail: | Connector Header Through Hole, Right Angle 60 posi... |
DataSheet: | 75867-309LF Datasheet/PDF |
Quantity: | 1000 |
180 +: | $ 1.57185 |
Operating Temperature: | -- |
Insulation Height: | 0.362" (9.20mm) |
Contact Shape: | Square |
Contact Finish - Mating: | Gold, GXT™ |
Contact Finish Thickness - Mating: | 15.0µin (0.38µm) |
Contact Finish - Post: | Tin |
Contact Material: | Phosphor Bronze |
Insulation Material: | Thermoplastic, Glass Filled |
Features: | Keying Slot |
Overall Contact Length: | -- |
Ingress Protection: | -- |
Material Flammability Rating: | UL94 V-0 |
Insulation Color: | Blue |
Current Rating: | -- |
Voltage Rating: | -- |
Mated Stacking Heights: | -- |
Contact Finish Thickness - Post: | 78.7µin (2.00µm) |
Applications: | -- |
Number of Positions Loaded: | All |
Packaging: | Tube |
Part Status: | Active |
Connector Type: | Header |
Contact Type: | Male Pin |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions: | 60 |
Number of Rows: | 2 |
Row Spacing - Mating: | 0.100" (2.54mm) |
Series: | Quickie™ |
Style: | Board to Cable/Wire |
Shrouding: | Shrouded - 4 Wall |
Mounting Type: | Through Hole, Right Angle |
Termination: | Solder |
Fastening Type: | Push-Pull |
Contact Length - Mating: | 0.236" (6.00mm) |
Contact Length - Post: | 0.120" (3.05mm) |
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75867-309LF Application Field and Working Principle
The Molex 75867-309LF is specifically designed for easy-to-assemble, high-density, right-angle, double-row, 0.050” pitch headers. Theseheaders feature a low profile, offset dual beam header for polarization and secure mating in confined spaces. The headers are available in standard lengths whichcan be customized.
The Molex 75867-309LF provides cost-effective surface mount board-to-board interconnection solutions. The dual-beam contact construction of these headers ensures signal integrity in mating and unmating cycles. The two-piece beam design ensures high conductivity.
Application Field
The Molex 75867-309LF is ideal for a wide range of applications. It is commonly used in the automotive, medical, and military/aerospace industries, as well as in consumer electronics. It is also suitable for use in circuit board-to-board applications requiring high-density, high-reliability, and low-profile connectors.
Working Principle
The Molex 75867-309LF utilizes a two-piece beam design to ensure high conductivity. The contacts are composed of horizontal beams that are placed at an angle in order to reduce crosstalk. Additionally, a vacuum generator is integrated within the front portion of the beams to secure removal of sheath gas in order to provide a strong, cost-effective, and reliable connection. The two-piece beam design allows for a lower profile, improved durability, and easier handling.
In addition, the headers feature a polarized bar that allows the user to orient the header into predetermined positions. This ensures that the connector and header are mated accurately. The offset dual beam contacts also ensure secure mating in confined spaces.
Conclusion
The Molex 75867-309LF is an ideal choice for providing a cost-effective board-to-board interconnection solution. The two-piece beam contact design ensures a reliable connection and the polarized feature ensures the header is mated accurately. The offset dual beam contacts and low profile make it suitable for use in crowded and confined spaces. This makes it the perfect solution for a variety of applications.
The specific data is subject to PDF, and the above content is for reference
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