| Allicdata Part #: | A105046-ND |
| Manufacturer Part#: |
808-AG11D-ES-LF |
| Price: | $ 0.95 |
| Product Category: | Connectors, Interconnects |
| Manufacturer: | TE Connectivity AMP Connectors |
| Short Description: | CONN IC DIP SOCKET 8POS GOLD |
| More Detail: | N/A |
| DataSheet: | 808-AG11D-ES-LF Datasheet/PDF |
| Quantity: | 1818 |
| 1 +: | $ 0.86310 |
| 10 +: | $ 0.75978 |
| 25 +: | $ 0.71518 |
| 50 +: | $ 0.68544 |
| 100 +: | $ 0.65558 |
| 250 +: | $ 0.59598 |
| 500 +: | $ 0.53638 |
| 1000 +: | $ 0.47678 |
| 2500 +: | $ 0.43209 |
| Features: | Open Frame |
| Contact Resistance: | 10 mOhm |
| Material Flammability Rating: | UL94 V-0 |
| Termination Post Length: | 0.125" (3.18mm) |
| Operating Temperature: | -55°C ~ 105°C |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Contact Material - Post: | Copper |
| Contact Finish Thickness - Post: | 20.0µin (0.51µm) |
| Contact Finish - Post: | Gold |
| Pitch - Post: | 0.100" (2.54mm) |
| Termination: | Solder |
| Series: | 800 |
| Mounting Type: | Through Hole |
| Contact Material - Mating: | Beryllium Copper |
| Contact Finish Thickness - Mating: | 20.0µin (0.51µm) |
| Contact Finish - Mating: | Gold |
| Pitch - Mating: | 0.100" (2.54mm) |
| Number of Positions or Pins (Grid): | 8 (2 x 4) |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Part Status: | Active |
| Packaging: | Tube |
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The 808-AG11D-ES-LF is a type of socket designed for use with integrated circuits, transistors, and other semiconductor devices.
The socket is popularly used for the application of ICs which are generally sensitive to shock, vibration, and moisture. The 808-AG11D-ES-LF socket is also designed to provide protection for the ICs against electrical overvoltage and ESD (electrostatic discharge) without any additional components be used. The 808- AG11D-ES-LF socket is also designed to not require any soldering or complex mounting processes.
The 808-AG11D-ES-LF socket is an open-frame, plastic molded socket that features two rows of 21 pins arranged in a 0.6" pitch. It has an open-frame configuration that provides access to the components in the socket for ease of inspection. The 808-AG11D-ES-LF socket also features a floating center section with two interlocking lids that locks the IC in place on the pins. Two sets of standoffs are also provided to provide better contact between the pins and the IC.
The working principle of the 808-AG11D-ES-LF socket is quite simple. The socket has two sets of associated pins; one set is connected to the IC, and the other set is connected to the circuit board. When the two lids are locked down, a current flows between the two pins creating an electrical connection between the IC and the circuit board. This connection helps to ensure proper signal transmission which is essential for the performance of the ICs.
The 808-AG11D-ES-LF socket provides a secure connection for ICs, transistors, and other semiconductor devices while also providing protection against electrical overvoltage and ESD. The socket also eliminates the need for complex soldering and mounting processes, making it an ideal choice for applications where time is of the essence.
In conclusion, the 808-AG11D-ES-LF socket is an effective and efficient way to provide a secure connection to ICs, transistors, and other semiconductor devices. The open-frame design allows for easy inspection of the components in the socket, while the two interlocking lids provide a reliable electrical connection. The 808- AG11D-ES-LF socket also eliminates the need for complex soldering and mounting processes, making it an ideal choice for any application requiring quick and reliable connections.
The specific data is subject to PDF, and the above content is for reference
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808-AG11D-ES-LF Datasheet/PDF