816-AG10D Allicdata Electronics
Allicdata Part #:

816-AG10D-ND

Manufacturer Part#:

816-AG10D

Price: $ 2.74
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN IC DIP SOCKET 16POS GOLD
More Detail: N/A
DataSheet: 816-AG10D datasheet816-AG10D Datasheet/PDF
Quantity: 1000
1200 +: $ 2.49327
Stock 1000Can Ship Immediately
$ 2.74
Specifications
Termination: Solder
Contact Resistance: 10 mOhm
Current Rating: 3A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: -55°C ~ 105°C
Housing Material: Polyester
Contact Material - Post: --
Contact Finish Thickness - Post: --
Contact Finish - Post: --
Pitch - Post: 0.100" (2.54mm)
Series: 800
Features: Open Frame
Mounting Type: Through Hole
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 16 (2 x 8)
Type: DIP, 0.3" (7.62mm) Row Spacing
Part Status: Active
Packaging: Tube 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for ICs, Transistors is one of the widely used technologies today for applications in manufacturing and communications. One of the more prominent examples of such sockets is the 816-AG10D socket, which offers high-performance connection management solutions for ICs. This article discusses the working principles and application fields of the 816-AG10D socket in detail.

The 816-AG10D socket is designed to provide high-class high-speed connection management solutions tailored to the specific needs of ICs. The main components of the system include an array of pins, an enclosure, and a control box. The pin array consists of eight rows of two pins arranged in a single file. The individual pins are equipped with temperature sensors and copper leads for a secure connection. The enclosure is made of aluminum alloy and is lead-free, ensuring safety during operation.

The control box of the 816-AG10D socket includes both analog and digital components. Analog components are responsible for reading and controlling the voltage source as well as signal routing. Specific hardware configurations provide temperature compensation features, which ensure greater accuracy and reliability of the readings. Digital components include logic circuits for task scheduling and fan control.

The 816-AG10D socket is ideally suited for applications in industrial communication and manufacturing. It is suitable for use in fan control, thermal management, and power management applications. Its temperature-sensing capabilities permit it to be used in temperature control systems, providing reliable performance even in extreme temperatures. The socket\'s control abilities enable functionality such as power save mode, signal routing, and device select/deselect. The socket also provides connection diagnostics for improved maintenance.

The 816-AG10D socket uses a combination of time-division-multiplexing (TDM), frequency-division-multiplexing (FDM), and power-division-multiplexing (PDM) techniques for connecting ICs. With TDM, a specific time period is allocated to each IC and signals from each IC are transmitted in sequence. FDM allows multiple signals to be transmitted simultaneously on the same socket, while PDM divides the power supply on the socket into multiple channels to provide power to multiple ICs.

In conclusion, the 816-AG10D socket is an advanced socket designed for applications in industrial communication and manufacturing. Its TDM, FDM, and PDM techniques enable it to provide high-speed connection management solutions tailored to the specific needs of ICs. Its temperature-sensing capabilities, control abilities, and connection diagnostics provide reliable performance even in extreme temperatures and enable functionality such as power save mode, signal routing, and device select/deselect. This makes the 816-AG10D socket an ideal choice for IC applications.

The specific data is subject to PDF, and the above content is for reference

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