816-AG11D Allicdata Electronics
Allicdata Part #:

A121365-ND

Manufacturer Part#:

816-AG11D

Price: $ 2.84
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN IC DIP SOCKET 16POS GOLD
More Detail: N/A
DataSheet: 816-AG11D datasheet816-AG11D Datasheet/PDF
Quantity: 1056
1 +: $ 2.57670
10 +: $ 2.47086
25 +: $ 2.26498
50 +: $ 2.16203
100 +: $ 2.05909
250 +: $ 1.80170
500 +: $ 1.75023
1000 +: $ 1.49284
2500 +: $ 1.38989
Stock 1056Can Ship Immediately
$ 2.84
Specifications
Termination: Solder
Contact Resistance: 10 mOhm
Current Rating: 3A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: -55°C ~ 105°C
Housing Material: Polyester
Contact Material - Post: --
Contact Finish Thickness - Post: --
Contact Finish - Post: --
Pitch - Post: 0.100" (2.54mm)
Series: 800
Features: Open Frame
Mounting Type: Through Hole
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 16 (2 x 8)
Type: DIP, 0.3" (7.62mm) Row Spacing
Part Status: Active
Packaging: Tube 
Description

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The 816-AG11D is a type of socket for integrated circuits (ICs), transistors, and other small components. It provides a secure, low-profile connection for compatible ICs and transistors on one end, and access to the electrical connections of these components on the other end. It facilitates easy assembly and repair of circuits. This article will discuss the application field and working principle of the 816-AG11D.

Application Fields

The 816-AG11D is used in a variety of applications, primarily in electronic production and assembly. Its compact dimensions allow it to fit into confined spaces while still providing a secure connection. This makes it well-suited for wiring boards or assemblies with limited space. Additionally, it is designed to withstand vibration, shocks, and other environmental stresses, allowing it to be used in a range of operating conditions.

The 816-AG11D is well-suited for applications where precise connections are required. Its compact design is ideal for precise and secure connections when space is limited, and its ability to withstand vibration and shocks allows it to be used in a variety of harsh conditions. Furthermore, its low-profile design facilitates streamlined production and repairs.

Working Principle

The 816-AG11D works by providing a mechanical connection between the IC or transistor and the circuit board. When installed, the pins and connections of the IC or transistor are secured in place, while the electrical connections are exposed on the other side. When plugged into the appropriate panel-mounted connection, the electrical connections are exposed. This allows current to flow between the circuit board and the IC or transistor, creating an electrical connection.

The 816-AG11D is designed with a locking mechanism to ensure a secure connection. When the socket is inserted, the locking mechanism secures the pins and connections of the IC or transistor in place. This prevents any accidental disconnections or loose connections. Furthermore, the locking mechanism prevents the socket from being pulled out due to environmental stresses such as vibration and shock.

The 816-AG11D also features an insulation sleeve. This sleeve provides protection against unexpected voltage shocks and keeps the electrical connections isolated from one another. This is important for safety reasons, as it prevents the power flow from connecting between different circuits and prevents operators from receiving electric shocks.

Conclusion

The 816-AG11D socket is a reliable and secure connection for ICs, transistors, and other small components. Its low-profile design allows it to fit in tight spaces, while its locking mechanism and insulation sleeve provide protection against accidental disconnections and voltage shocks. Its sturdy construction and reliable operation make it ideal for a variety of applications, from assembly to repair and beyond.

The specific data is subject to PDF, and the above content is for reference

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