828-AG11D-ESL-LF Allicdata Electronics
Allicdata Part #:

A121608-ND

Manufacturer Part#:

828-AG11D-ESL-LF

Price: $ 2.37
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN IC DIP SOCKET 28POS GOLD
More Detail: N/A
DataSheet: 828-AG11D-ESL-LF datasheet828-AG11D-ESL-LF Datasheet/PDF
Quantity: 2477
1 +: $ 2.16090
10 +: $ 2.07585
25 +: $ 1.90285
50 +: $ 1.81642
100 +: $ 1.72985
250 +: $ 1.51364
500 +: $ 1.47038
1000 +: $ 1.25416
2500 +: $ 1.16766
Stock 2477Can Ship Immediately
$ 2.37
Specifications
Features: Open Frame
Contact Resistance: 10 mOhm
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: -55°C ~ 105°C
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Contact Material - Post: Copper
Contact Finish Thickness - Post: Flash
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Termination: Solder
Series: 800
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: Flash
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.6" (15.24mm) Row Spacing
Part Status: Active
Packaging: Tube 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The 828-AG11D-ESL-LF is a type of socket which is built for use with a specific type of integrated circuit, transistors, or other components with similar electrical connections. It is designed to quickly and efficiently mount and secure such devices to their circuit boards. This type of socket has many advantages over soldering a device directly or using a mechanical connector.

Features

The 828-AG11D-ESL-LF has several features that make it suitable for these specific applications. It is designed to have a large contact area, which helps to spread the load more evenly. This helps to reduce the possibility of damage due to over-voltage or current surges. The contacts are also designed to provide a low contact resistance, which allows for higher current flow and improved performance.

The socket is constructed of a special alloy which helps enhance its electrical and mechanical properties. The connection terminals are connected to the board via gull-winged leads. The gold-plated contacts provide improved electrical performance and minimizes corrosion.

Application Field and Working Principle

The 828AG11D-ESL-LF is typically used with components such as integrated circuits, transistors, and other components with similar electrical connections. It is designed to rapidly and securely mount itself onto a circuit board, and then apply the proper amount of power and signal for the particular device. The socket is designed with several features that improve device performance. These features include a large contact area, low contact resistance, and gold-plated contacts.

The 828-AG11D-ESL-LF also features a special alloy that improves its electrical and mechanical characteristics. This helps to provide a reliable connection without significantly increasing cost. The socket also features a flexible strain relief that can be molded to fit the exact dimensions of the component being attached. This helps to reduce the possibility of damage, and improve the overall reliability and performance of the connection.

The design and construction of the 828-AG11D-ESL-LF provides many advantages over traditional methods of connecting electrical components, such as soldering or mechanical connecting. This is because the socket eliminates the need for any time-consuming soldering or complicated assembly. It is also designed to easily and quickly mount and secure its components. Additionally, due to the increased contact area and low contact resistance, the device offers improved performance and reliability. Therefore, this type of socket is ideal for use with integrated circuits, transistors, and other components with similar electrical connections.

The specific data is subject to PDF, and the above content is for reference

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