84501-201

The 84501-201 array edge type mezzanine board to board rectangular connector is a high performance interconnect solution that provides up to 413 positions for densely packed, maximum density interconnection applications. This connector\'s high contact densities are achieved while maintaining a power density of up to 300mA per square centimeter and a current rating of up to 10 amps per pin. Perfect for dense power or signal routing applications, the 84501-201 connector offers a variety of performance characteristics in a space-saving form factor.

The 84501-201array edge type mezzanine board to board connector is best suited for applicatons that require a higher performance, more compact interconnection alternative than traditional array connectors. This connector utilizes an innovative design that allows for higher current carrying capability and signal integrity in a reduced form factor. The 84501-201 is designed with an actuating plate that provides enhanced latching power, and has double force engagement feature that ensures firm mating for optimum protection against contact damage. The 84501-201 also offers an improved signal and ground contact shield that minimizes ground crosstalk and eliminates signal to socket interface that help ensure signal integrity.

The 84501-201 connector also offers a robust design that allows for environmentally harsh operating conditions. The connector is designed to withstand high temperature environments up to 170°C, and boasts an operating pressure rating of 200lbs of contact force (LCTF) when mated. The 84501-201 connector also features a water immersion rating of 25m water depth, making it suitable for many marine and automotive applications.

This 84501-201 application field and working principle offers many advantages and benefits to its user. The connector provides high contact densities, robust design, and latching power and double force engagement which ensure optimum connection and protection against contact damage. The 84501-201 also offers signal and ground contact shield, high temperature ratings, and a water immersion rating which makes it suitable for harsh operating conditions. Its compact size and power density make it a great choice for applications that require high performance in a space-saving form factor. All of these features make the 84501-201 a great solution for densely packed, maximum density interconnection applications.