85-PGM11007-10 Allicdata Electronics
Allicdata Part #:

85-PGM11007-10-ND

Manufacturer Part#:

85-PGM11007-10

Price: $ 8.29
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN SOCKET PGA GOLD
More Detail: N/A
DataSheet: 85-PGM11007-10 datasheet85-PGM11007-10 Datasheet/PDF
Quantity: 1000
9 +: $ 7.53480
Stock 1000Can Ship Immediately
$ 8.29
Specifications
Termination: Solder
Contact Resistance: --
Current Rating: 3A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.165" (4.19mm)
Operating Temperature: -55°C ~ 105°C
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: PGM
Features: --
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): --
Type: PGA
Part Status: Active
Packaging: Bulk 
Description

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The 85-PGM11007-10 is a high-speed and highly reliable communication socket for ICs, transistors and other electronic components. It is a preferred tool for board-level electrical and electromagnetic compatibility (EMC) testing.

The 85-PGM11007-10 socket is constructed of multiple layers of high-temperature Kapton film with robust EMI/RFI shielding, low insertion force contacts, and a machined dielectric base that helps properly align the socket on the target component.

Its application fields cover testing and development of electronic circuits, automotive, telecom, and power management circuits for various products, including mobile phones, CD players, laptop computers, LCD monitors, and other consumer electronics.

85-PGM11007-10 sockets are a perfect choice for advanced development projects due to their robust design, highly stable performance, and low current draw. It provides design engineers with a reliable, repeatable, and consistent electrical connection to the component under test.

The 85-PGM11007-10 socket is designed with an improved insertion force contact, which reduces the amount of force required to make connections to the target components. This results in a more reliable electrical connection and improved signal integrity. The socket also assists in reducing EMI emissions and interference, as well as improving thermal management.

The 85-PGM11007-10 socket has two sets of contacts, one for power and the other for signal. The power contacts are designed to carry the signal current in both directions, while the signal contacts are designed to carry the data signal only. The socket also provides additional features such as ESD protection, EMI shielding, and current limiting.

85-PGM11007-10 sockets are designed to be capable of handling high-powered situations, such as rapid thermal changes and extreme power surges. The socket contact system can be tailored to suit the application\'s specific requirements, allowing for maximum flexibility in a variety of test and development situations.

The socket\'s working principle is based on the dual-beam principle, utilizing a two-beam contact system that increases signal integrity over more conventional single-beam contact systems. The dual-beam contact system provides a more reliable electrical connection than single-beam contact systems, as more of the connection is made directly with the device’s package pins. This ensures that the instantaneous changes in currents are properly transferred and amplified as cleanly and accurately as possible.

The 85-PGM11007-10 sockets are reliable, highly adaptive, and are manufactured to exacting standards. They are designed to provide maximum compatibility and reliability under diverse working conditions, making them an ideal choice for a wide range of development projects.

The specific data is subject to PDF, and the above content is for reference

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