89HT0808PYAABG Allicdata Electronics
Allicdata Part #:

89HT0808PYAABG-ND

Manufacturer Part#:

89HT0808PYAABG

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: IDT, Integrated Device Technology Inc
Short Description: IC PCIE RETIMER 8CH 100CABGA
More Detail: Signal Retimer Interface 100-CABGA (9x9)
DataSheet: 89HT0808PYAABG datasheet89HT0808PYAABG Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Packaging: Tray 
Part Status: Obsolete
Applications: Signal Retimer
Interface: I²C
Voltage - Supply: --
Package / Case: 100-LFBGA
Supplier Device Package: 100-CABGA (9x9)
Mounting Type: Surface Mount
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The 89HT0808PYAABG is a conductive thermal interface compound that can provide efficient heat transfer between two components. It has been designed to provide efficient cooling and heat dissipation to improve the performance of electronic systems. With its low viscosity, this material can also be used in applications that require thermal gap filling and insulation.

The 89HT0808PYAABG has a broad range of uses that span across multiple industries. It is commonly used in the automotive, medical, industrial and consumer electronics sectors. In the automotive industry, it is used in engine control units, audio amplifiers and hub motors. For medical and industrial applications, it is often used to connect medical and laboratory equipment, as well as high-power semiconductor devices.

The 89HT0808PYAABG is composed of several components, including a silicone base, boron nitride powder, aluminum oxide powder and silica platelets. The silicone base acts as the main adhesive, providing a strong bond between the two components. Boron nitride powder and aluminum oxide powder serve to enhance conductivity and thermal transfer. The silica platelets act as a filler material, providing additional insulation between the two components.

The 89HT0808PYAABG works by creating a thermal bridge between two components, allowing heat to travel efficiently. The silicone base serves as a thermal bridge by increasing the surface area of contact between components. The boron nitride and aluminum oxide powder then helps to improve the thermal conductivity of the material, allowing heat to travel faster. Finally, the silica platelets provide additional insulation, preventing heat from escaping the contact area.

The 89HT0808PYAABG is an excellent choice for applications that require effective heat transfer. Its low viscosity and excellent thermal properties allow it to be used in a variety of applications, providing efficient cooling and heat dissipation. Its wide range of uses make it a versatile solution for many different industries.

The specific data is subject to PDF, and the above content is for reference

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