A 18-LC-TR Allicdata Electronics
Allicdata Part #:

AE9997-ND

Manufacturer Part#:

A 18-LC-TR

Price: $ 0.22
Product Category:

Connectors, Interconnects

Manufacturer: ASSMANN WSW Components
Short Description: CONN IC DIP SOCKET 18POS TIN
More Detail: N/A
DataSheet: A 18-LC-TR datasheetA 18-LC-TR Datasheet/PDF
Quantity: 2152
1 +: $ 0.20790
10 +: $ 0.19404
25 +: $ 0.16632
50 +: $ 0.14137
100 +: $ 0.13583
250 +: $ 0.12197
500 +: $ 0.11642
1000 +: $ 0.09702
2500 +: $ 0.08870
Stock 2152Can Ship Immediately
$ 0.22
Specifications
Termination: Solder
Contact Resistance: 30 mOhm
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.124" (3.15mm)
Operating Temperature: -55°C ~ 85°C
Housing Material: Polybutylene Terephthalate (PBT)
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: --
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: --
Features: Open Frame
Mounting Type: Through Hole
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: --
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 18 (2 x 9)
Type: DIP, 0.3" (7.62mm) Row Spacing
Part Status: Active
Packaging: Tube 
Description

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A 18-LC-TR is one of the integrated socket and header devices and is a package for transistors that provides a complete electrical connection from a printed circuit board to the transistor. It consists of a socket or header, with two or more terminal pins, and a trust element. The terminal pins provide a reliable hard mate connection with the printed circuit board, while the trust element is used to hold the transistor securely in place, ensuring good electrical contact between the two surfaces. The trust element is available in different sizes and can be adjusted to suit the size of the transistor or package.

The 18-LC-TR was designed with a special focus on miniaturization and reliability. It utilizes advanced contacts that are optimized for high density, improved reliability and longer life. All components are optimized for low power consumption, while the contacts are specifically designed to reduce contact force. The 18-LC-TR is also designed with an advanced socket which has an improved conductivity, an ergonomic design, and better performance in the presence of EMI. This makes it ideal for applications where miniaturization and reliability are a priority.

18-LC-TR package type has a wide range of applications. It is used mainly for integrated circuits and transistors in the semiconductor industry. It is also used in telecommunications, automotive, computer peripherals, consumer electronics, industrial automation, medical, gaming, and various other applications. Additionally, the 18-LC-TR is also used for integrated circuits, such as microprocessors, memory devices, and other specially packaged components such as backplanes and connectors.

In terms of working principle, the 18-LC-TR socket works similarly to other types of integrated sockets and headers. Depending on the type of socket, it might contain two or more terminal pins. The contact pins provide a reliable hard mate connection with the printed circuit board, and a trust element or contact pin helps to hold the transistor securely in place, with good electrical contact between the two surfaces. This ensures a good signal transmission and connection, without any distractions.

When the socket is loaded with a transistor, the contacts are connected to the board, and the trust element ensures that the signal transmission will remain good. The trust element or contact pin is adjustable and can be modified to fit the size of the transistor. This helps to ensure a reliable electrical contact between the two surfaces and eliminates risk of damage caused by vibration or physical stress during shipment and/or operation.

In summary, the 18-LC-TR is an integrated socket and header device that is commonly used to connect transistors and integrated circuits on printed circuit boards. It provides a reliable hard mate connection, improves signal transmission, and eliminates risk of mechanical damage caused by vibration. Its small size and low power consumption make it ideal for applications where miniaturization and reliability are a priority.

The specific data is subject to PDF, and the above content is for reference

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