ACCS-127-32SP1 Allicdata Electronics
Allicdata Part #:

ACCS-127-32SP1-ND

Manufacturer Part#:

ACCS-127-32SP1

Price: $ 0.22
Product Category:

Connectors, Interconnects

Manufacturer: ASSMANN WSW Components
Short Description: PLCC SOCKET, 44 CONTACTS, SMT,
More Detail: N/A
DataSheet: ACCS-127-32SP1 datasheetACCS-127-32SP1 Datasheet/PDF
Quantity: 1000
145 +: $ 0.20864
Stock 1000Can Ship Immediately
$ 0.22
Specifications
Series: *
Part Status: Active
Description

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ACC-127-32SP1 is part of the Sockets for ICs, Transistors family. It is a high performance socket that was designed for Pin-Grid Array (PGA) and Ball Grid Array (BGA) packages, and it provides reliable electrical connectivity and stability.

The ACC-127-32SP1 has two major functions. Firstly, it is used to securely hold the packaged electronic components in place for testing and mounting purposes, without affecting performance. Secondly, it serves as an electrical connector between boards, providing the necessary electrical contact for uninterrupted communication between devices.

The ACC-127-32SP1 socket consists of a frame, contact pins, wires, springs, and solder pads. The frame is the main structural component of the socket, providing the necessary rigidity to hold the connectors in place. Contact pins are attached to the ends of the frame to make contact with the sockets on the boards. The wires provide the electrical connection between the contact pins and the solder pads on either side of the pins. Finally, the springs are used to ensure proper contact pressure while forming the electrical connection between the two sockets.

The application of ACC-127-32SP1 is in the field of electronic testing. Its ability to securely hold packaged electronic components in place without affecting performance, makes it ideal for testing purposes. The socket also provides reliable electrical connections to a wide variety of boards.

The working principle of the ACC-127-32SP1 is simple. When a board is inserted into the socket, the contact pins make contact with the sockets on the board while the springs ensure constant contact pressure ensuring reliable electrical connection. The wires then carry the electrical signals between the contact pins and the solder pads on the socket.

In summary, ACC-127-32SP1 is a high performance socket designed for Pin-Grid Array (PGA) and Ball Grid Array (BGA) packages. It is used to securely hold packaged electronic components in place for testing and mounting purposes, without affecting performance, and it also provides reliable electrical connections between boards. Its working principle is fairly straightforward, and its application is mainly in the field of electronic testing.

The specific data is subject to PDF, and the above content is for reference

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