AXT426164 Allicdata Electronics
Allicdata Part #:

AXT426164-ND

Manufacturer Part#:

AXT426164

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Panasonic Electric Works
Short Description: CONN HEADER .4MM 26POS SMD
More Detail: 26 Position Connector Header, Center Strip Contact...
DataSheet: AXT426164 datasheetAXT426164 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: P4S
Packaging: Tape & Reel (TR) 
Part Status: Obsolete
Connector Type: Header, Center Strip Contacts
Number of Positions: 26
Pitch: 0.016" (0.40mm)
Number of Rows: 2
Mounting Type: Surface Mount
Features: Solder Retention
Contact Finish: Gold
Contact Finish Thickness: --
Mated Stacking Heights: 1.5mm, 2.5mm
Height Above Board: 0.049" (1.25mm)
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The AXT426164 is a high-density mezzanine connector designed to be used in a variety of interconnect applications. This highly reliable product was designed with a low profile, small form factor which allows it to perform in various application fields, including telecom, datacom, medical, military, and industrial systems. The AXT426164 is a key component in the development of next-generation mezzanine systems that meet the needs of various interconnect applications.

The AXT426164 is a four-layer connector which consists of a substrate, two top and bottom connectors, and a metal shield. The substrate is created using a thermoplastic blend of UL94V-0 and FR-4 materials, and the connectors are made from a high-quality phosphor bronze material. The metal shield is designed to provide protection against EMI/RFI, and the overall product can handle temperatures ranging from -55 to +85 degrees Celsius.

The AXT426164 is designed to provide customers with a reliable interconnect solution through its unique features and capabilities. This connector offers two different positions in order to accommodate a variety of different PCB layouts and module designs. Additionally, the AXT426164 features a push-pull locking mechanism for easy installation and removal. This product also features enhanced contact durability and enhanced ESD performance due to its “closed cavity” design. The AXT426164 also offers a 0.8mm pitch, which allows for higher densities of pins in a small form factor.

In terms of working principle, the AXT426164 utilizes an array of contacts which are designed to provide an electrically sound interconnect. The contacts are arranged in a linear pattern and feature gold plating for increased corrosion resistance, improved electrical performance, and excellent contact reliability. Each array contains up to 8 contacts which are based on a 0.8mm pitch. In order to make reliable electrical connections, the contacts must be properly aligned and connected within a module and board to ensure proper operation.

The AXT426164 is an excellent choice for a variety of mezzanine application fields. Due to its enhanced contacts and EMI shielding capabilities, this product is perfect for a range of industrial, telecom, datacom, medical, and military applications. This product is also designed to handle extreme temperatures, allowing it to function in environments ranging from automotive and avionic applications to precise industrial applications. Additionally, its shear off feature allows it to also be used as a temporary connection for prototypes or when prototyping.

In summary, the AXT426164 is a mezzanine connector which offers a variety of features and benefits that make it an ideal choice for a variety of interconnect applications. This product’s four-layer construction and metallic shield provide enhanced durability and EMI/RFI protection. Additionally, the AXT426164 offers enhanced electrical performance, as well as improved contact reliability and a push-pull installation/removal mechanism. This product is an excellent choice for a wide array of mezzanine applications and is perfect for customers who require high-density, highly reliable interconnect solutions.

The specific data is subject to PDF, and the above content is for reference

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