BDL-116-G-F Allicdata Electronics
Allicdata Part #:

BDL-116-G-F-ND

Manufacturer Part#:

BDL-116-G-F

Price: $ 7.33
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: INTERCONNECT STRIPS
More Detail: Connector Header Through Hole 32 position 0.100" (...
DataSheet: BDL-116-G-F datasheetBDL-116-G-F Datasheet/PDF
Quantity: 1000
1 +: $ 6.59610
Stock 1000Can Ship Immediately
$ 7.33
Specifications
Series: BDL
Packaging: Tube 
Part Status: Active
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.100" (2.54mm)
Number of Positions: 32
Number of Rows: 2
Row Spacing - Mating: 0.100" (2.54mm)
Number of Positions Loaded: All
Style: Board to Board
Shrouding: Unshrouded
Mounting Type: Through Hole
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.122" (3.10mm)
Contact Length - Post: 0.125" (3.18mm)
Overall Contact Length: 0.332" (8.43mm)
Insulation Height: 0.085" (2.15mm)
Contact Shape: Circular
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Post: Nickel
Contact Material: --
Insulation Material: Polyamide (PA), Nylon
Features: --
Operating Temperature: -55°C ~ 125°C
Ingress Protection: --
Material Flammability Rating: --
Insulation Color: Black
Current Rating: --
Voltage Rating: --
Mated Stacking Heights: --
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Applications: --
Description

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Rectangular Connectors - Headers, Male Pins, as the name suggests, are specifically designed for use in various electrically connected environments. The BDL-116-G-F cable connectors, in particular, offer a reliable and trusted option for a number of different applications. This article will provide an overview of the BDL-116-G-F cable connectors, their application field and working principle so that users can determine if they are the most suitable connector for their requirements.The BDL-116-G-F connector is a board-to-board right-angle type connector with two rows of contacts. The contacts are configured as in a two-row, 15-position header style. Each single position holds a contact with insulated pins connected to the ground and two connections on the adjacent side. It is also designed to be pluggable and removable, with positive latching. The connector has a number of advantageous features, such as its ultra-compact design that enables it take up minimal space when being used. In addition, its visually appealing look makes it suitable for a variety of applications. It also has the ability to withstand high temperatures, making it suitable for high-endurance applications. Furthermore, it can support the transmission of digital and analog signals with its quick-connect-and-release feature.The BDL-116-G-F connector is most suited for applications involving printed circuit boards (PCBs) and backplanes where physical space is a major concern. This is because the closer the contacts are placed together, the more circuitry can be built into a given space. It is also an excellent choice for applications between 1-10 Gbps in data transfer rates, which is ideal for use in Data Center or 5G networks.The working principle of the BDL-116-G-F connector can be described as follows: The connection is made either by manually pressing or from a simple machine like an automated machine. When the connection is made, the contact pins cross the board and contact the pads of the opposite board. The contact pins have insulation sleeves and can thus support voltage of up to 100 VAC. The BDL-116-G-F connector has proven to be a reliable and effective solution for a variety of applications in the technology market. Its cost-effectiveness for both companies and consumers has also led to its increased popularity in recent years. Its small size and ease of operation makes it ideal for applications where space is of primary concern. Furthermore, its quick-connect-and-release feature makes it suitable for applications requiring high-speed data transfer rates. All of these factors make the BDL-116-G-F connector an ideal option for the technology industry.

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