BMI-S-206-F-H400 Allicdata Electronics
Allicdata Part #:

BMI-S-206-F-H400-ND

Manufacturer Part#:

BMI-S-206-F-H400

Price: $ 12.71
Product Category:

RF/IF and RFID

Manufacturer: Laird Technologies EMI
Short Description: BLS 2PSH FRM SNSAT LP
More Detail: RF Shield Frame 1.326" (33.68mm) X 1.450" (36.83mm...
DataSheet: BMI-S-206-F-H400 datasheetBMI-S-206-F-H400 Datasheet/PDF
Quantity: 1000
90 +: $ 11.55600
Stock 1000Can Ship Immediately
$ 12.71
Specifications
Series: --
Packaging: Bulk 
Part Status: Active
Type: Frame
Height - Overall: 0.200" (5.08mm)
Length - Overall: 1.450" (36.83mm)
Width - Overall: 1.326" (33.68mm)
Ventilation: --
Mounting Type: Solder
Description

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RF shields are devices that are designed to help manage and reduce the effects of radio frequency (RF) interference. They are often used in RF components, such as cell phones, satellite dishes, and Wi-Fi routers. The BMI-S-206-F-H400 is one such device that is used in order to reduce RF interference.

The BMI-S-206-F-H400 is a low-profile RF shield designed specifically for high-frequency applications. This shield features two layers of electro-deposited copper with an insulation layer between them. The layers of copper provide both protection and conductivity, making it an ideal choice for applications in which minimal interference is desired.

To understand how this shield works, it helps to first understand how RF interference affects electronic components. When an electronic device emits a signal, it causes an electromagnetic field to be sent out in all directions. Any other electronic device within that field will receive the interference. This interference can cause problems ranging from distortion of the signal to complete loss of the signal.

An RF shield is a device that is designed to block or reduce the signal, preventing it from reaching other electronic components. This shielding effect is created by the conductive properties of the layers of copper. The electro-deposited copper layers allow the shield to block out the RF interference, while still allowing passing of the desired signal.

The BMI-S-206-F-H400 is designed to be used in high-frequency applications where interference is especially troublesome. It is also designed to be low-profile, allowing it to be used in applications where space is at a premium. The electro-deposited copper layers have a low impedance, meaning they are capable of blocking out interference from a wide range of frequencies.

The BMI-S-206-F-H400 is an ideal choice for applications that require a low-profile, high-frequency RF shield. The two layers of electro-deposited copper provide both protection and conductivity, enabling the shield to block out interference from a wide range of frequencies. This makes the shielding effect superior to other shielding solutions, allowing it to be used in applications where other shields may not be effective.

The specific data is subject to PDF, and the above content is for reference

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