BSE-100-01-C-D

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Since the introduction of the electronic industry, the development of precision connectors has grown with the increase in requirements for faster data transmission and high-density connection solutions. A high-density recti-linear connector, BSE-100-01-C-D, is an example of a board-to-board (mezzanine) connector that has been designed for increased application fields and working principles.

BSE-100-01-C-D stands out as a high-density board-to-board connector with innovative features that allow it to be used in a variety of applications. It features 100 positions in three rows of 36, 18, and 18 contacts on 2mm centers, providing high connection density. With its dense configuration, it is typically used to bring power and signal up to the component side from the board side by allowing the layout of fewer power and signal lines. The contact technology used in this connector is stamped and formed phosphor bronze with gold-overlay plating. The contacts can be either solder or press-fit, providing an increased range of options for PCB design.

BSE-100-01-C-D is available in two versions, a straight and right-angled type. Both versions provide a secure locking system with improved mating, unmating performance even in space constrained or vibration prone applications. The dielectric housing material is polyester-imide and has anti-UV and moisture resistance properties, which make it suitable for outdoor applications. Furthermore, the angled version has a wide range of uses due to its low profile and optimized board-to-board design. It is also reverse appear compatible for easy back-to-back connections.

The working principle of BSE-100-01-C-D is straightforward and consists of two connector parts that mate together and are held in place by a retention clip. The contacts are spring loaded, so when two connector halves mate together, the contacts are compressed against the PCB surface. This provides a low force, low impedance connection. The contacts are designed to handle reliable data transmission up to 12Gbps per contact, making BSE-100-01-C-D suitable for use in data-intensive applications.

BSE-100-01-C-D is an ideal solution for high-density applications requiring fast data transmission rates. Its rectangular-array design and robust materials make it suitable for a wide variety of applications in the automotive, industrial, telecom, and consumer electronic fields. The vast range of options and features available makes it an ideal option for fitting into dense, board-to-board applications.

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