BSS-025-01-L-D-A-TR Allicdata Electronics
Allicdata Part #:

BSS-025-01-L-D-A-TR-ND

Manufacturer Part#:

BSS-025-01-L-D-A-TR

Price: $ 2.83
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: .635MM DOUBLE ROW SOCKET ASSEMBL
More Detail: 50 Position Connector Socket, Center Strip Contact...
DataSheet: BSS-025-01-L-D-A-TR datasheetBSS-025-01-L-D-A-TR Datasheet/PDF
Quantity: 1000
125 +: $ 2.57040
Stock 1000Can Ship Immediately
$ 2.83
Specifications
Series: BSS
Packaging: Tape & Reel (TR) 
Part Status: Active
Connector Type: Socket, Center Strip Contacts
Number of Positions: 50
Pitch: 0.025" (0.64mm)
Number of Rows: 2
Mounting Type: Surface Mount
Features: Board Guide
Contact Finish: Gold
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 5mm
Height Above Board: 0.135" (3.43mm)
Description

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BSS-025-01-L-D-A-TR is a rectangular connector array edge type mezzanine which is typically applied in board-to-board applications. This type of edge connector is capable of providing a reliable, compact and secure connection between two or more substrates (e.g. PCB, FPC, ribbon cable). This connector uses multiple-row connectors on both the mating substrate and the corresponding mating mate for added reliability and increased pin-out density.

The major feature of the BSS-025-01-L-D-A-TR is its compact design and the fact that it has high pin density. This is due to its multiple-row array structure, which allows for higher density of pins in a small footprint. This makes it ideal for applications where space and weight savings are key. Additionally, the array connector offers superior electrical performance and signal integrity, which makes it suitable for a wide range of applications, especially those where high data rates are critical.

In terms of working principle, BSS-025-01-L-D-A-TR connects to other components of board-to-board applications through soldering. The mating of the connector is done through the use of a soldering iron, solder paste, and flux. The solder paste is then applied to the connectors with a soldering iron. The heat from the soldering iron is used to heat the paste, which then turns into liquid solder. The heat from the soldering iron then melts the solder and the flux, which allows the components to be interconnected. The solder is then cooled and the connections are made.

Another application field for BSS-025-01-L-D-A-TR is in the connectorization of telecommunication systems. This type of array connector offers a high degree of flexibility because it can be customized to fit the specific requirements of various telecommunication systems. This flexibility allows for both economical and secure connections, which are essential in telecommunication systems that involve a wide range of data transfer rates. Additionally, the array connector provides superior electrical performance and signal integrity, which is critical for high speed telecommunications systems.

BSS-025-01-L-D-A-TR is extremely versatile in terms of its application. It works well with a wide range of substrates, can be designed for use with different pin configurations, and provides superior electrical performance and signal integrity. This makes it ideal for board-to-board applications, especially those that involve high data rates. Additionally, its highly customizable design makes it suitable for telecommunications systems, where flexibility and high data rate are important.

The specific data is subject to PDF, and the above content is for reference

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