BSS-050-01-F-D-A

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BSS-050-01-F-D-A is a mezzanine (board to board) type of rectangular connector, typically used to make an electrical connection between two printed circuit boards (PCBs). It is part of the Samtec family of modular connectors and arrays, which offer support for numerous applications, including high-speed data, RF, power, automotive, and medical.

Mezzanine (board to board) connectors are designed to provide a precisely measured, low-profile connection between two printed circuit boards (PCBs). They are the most common type of connection between two printed circuit boards, and are produced in a wide variety of sizes and configurations to meet the needs of various applications. With a wide range of features, including high contact density, low cost and excellent mechanical integrity, Samtec’s mezzanine (board to board) connectors are used in a range of applications, from data and telecommunications to automotive and industrial.

The BSS-050-01-F-D-A is a mezzanine (board to board) rectangular connector that can be used in a variety of applications, such as computers, medical equipment, test and measurement, instrumentation, consumer electronics, and automotive. Its main features include an array of 50 micro-pads with a 2mm pitch, gold-plated contacts, and a robust aluminum alloy shell.

The device’s working principle is based on the fact that electrical current can flow from one point to another, as long as the two points of contact are of appropriate material. In this case, the BSS-050-01-F-D-A provides an ideal connection between two printed circuit boards because it has precisely measured contacts and a low-profile connection that ensures reliable conductivity between the two points of contact. When the connector is inserted into the slot, the gold-plated contacts make an electrical connection and current can flow between the two boards.

The BSS-050-01-F-D-A connector is an ideal solution for board-to-board applications in a wide range of industries, from medical and automotive to data and telecommunications. Thanks to its robust construction and excellent materials properties, it provides reliable connections for a variety of applications and is suitable for use in harsh environments.

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