BSS-066-01-L-D-DP-EM2

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BSS-066-01-L-D-DP-EM2 is a rectangular connector arrays, edge type, mezzanine board to board connector. It highly reliable high speed interconnect designed for medical imaging and other demanding applications. It features a unique edge type terminal which allows direct soldering to a board, while providing 0.8 mm of board-to-board spacing.

The applications of BSS-066-01-L-D-DP-EM2 connectors are diversified and it can be used in many fields such as medical and industrial applications. It is suited for a high-performance, multi-layer PCB and other circuit boards. With its high contact density, it is ideal for high-capacity circuit boards that require high-density data connections.

Its working principle consists of a multiple-row electrical connection when terminals comes into contact with each other. It operates on a simple "edge-type" contact principle, where contact pins are positioned on the lower side of the board so that the board can be mounted directly above the board to which its contacting. When the board is connected, the two contact pins come into contact with each other and form an electrical connection. This electrical connection then allows data to be transferred from one board to the other. This type of connection is suited for high-speed applications due to its low power consumption and low signal distortion.

The BSS-066-01-L-D-DP-EM2 connector is well suited for connecting components in high temperature and hostile environments. It is designed to be able to withstand temperatures up to 150 °C, and is rated for high shock and vibration levels that occur in many industrial and medical applications. In addition to its robust design, this connector also features low signal reflection and crosstalk, making it ideal for high-speed data transfer applications. It is also designed with a low profile that can help reduce board space requirements.

The BSS-066-01-L-D-DP-EM2 connector is a highly reliable, high-speed interconnect designed to meet the needs of demanding medical imaging and other industrial applications. It is suitable for a high-density interconnection and is designed to operate in extreme environments. With its reliable contact system, low profile, and low power consumption, this is an ideal connector for a wide variety of electronic applications.

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