BTE-060-04-H-D-A-K

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BTE-060-04-H-D-A-K is a type of arrays, edge type, mezzanine connectors (board to board). It is a high-speed, low-profile system designed to connect to multiple boards and interconnected between different planes. From a technical point of view, BTE-060-04-H-D-A-K has a guaranteed electrical connection with a 5mm pitch, 110Ω differential impedance, and a high-frequency data rate up to 20Gb/s.

BTE-060-04-H-D-A-K is suitable for a wide range of industrial, medical, and telecommunications applications. It provides a secure connection between device boards and lower cross-talk levels to ensure reliable signal integrity in high-speed applications. The board-to-board connector’s cage and drain connection systems provide integrity and EMI shielding in harsh environment applications.

The BTE-060-04-H-D-A-K is a combination of single-ended and differential signal contact configurations with through-hole and surface mount contacts. It also features horizontal and vertical mating connectors with a fast and easy to use scoop-and-lock mating system. This allows for simple installation and maintenance, while providing the reliability required for board-to-board connections.

The working principle of BTE-060-04-H-D-A-K is relatively simple. The board-to-board connector uses two sets of male and female connectors which are mated together. The male pins on one side of the connector are inserted into the female sockets on the other side. Once the pins make contact with the sockets, an electrical connection is established working as a single unit. This connection is protected from shock and vibration by a press-fit or screw-fastened connection system.

BTE-060-04-H-D-A-K is designed to provide reliable and secure connections in applications such as home entertainment, industrial automation, medical electronics, board-level communications, aerospace systems, and more. It is a reliable and low-profile system that provides improved interconnectivity between multiple boards and planes. Moreover, it requires less space for high-density applications, and supports higher data rates for next-generation systems.

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