BTE-100-08-C-D

Series:	BTE
Packaging:	Tube
Part Status:	Active
Connector Type:	Header, Outer Shroud Contacts
Number of Positions:	200
Pitch:	0.031" (0.80mm)
Number of Rows:	2
Mounting Type:	Surface Mount
Features:	--
Contact Finish:	Gold
Contact Finish Thickness:	50.0µin (1.27µm)
Mated Stacking Heights:	30mm
Height Above Board:	1.151" (29.24mm)

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Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)

BTE-100-08-C-D is a multi-pin board-to-board connector that is widely used in various industries, especially those involving high-frequency signal transmission or power. It has 8 double-row pins insulated from each other; a card-edge type array connector and its working principle is simple- four of the contacts on each connector side are loaded and the other four are unloaded. The connector has a resistance of 10mΩ max in the unloaded position. Its application fields involve high-frequency signal transmission or power that requires multiple connections between two board. It can also be used in the printing and packaging industries, computers networks and communication systems. The BTE-100-08-C-D has several unique features that make it the perfect choice for industrial applications. Its multiple connectors allow it to be used in applications that require high-speed signal transmission or power with minimal pin insertion loss. Its high-impedance pin/sleeve contact arrangement withstands the high current densities and protects the pins from damage. The card-edge type array style of the connector reduces the contact height, thus allowing for a more compact layout with no compromise on performance. BTE-100-08-C-D has a compact size, thus ensuring a compact design footprint. Its high reliability allows for the connector to be used in a wide range applications. The connector also has a high insertion force, ensuring secure contact between the contacts at all times. The BTE-100-08-C-D connector is a perfect solution for a wide variety of applications. It provides high-speed signal transmission or power with minimal pin insertion loss. Its high-impedance pin/sleeve contact arrangement allows it to withstand high current densities while providing reliable and secure contact between pins at all times. Its simple mounting system and card-edge type array style reduce height and increase board density. Finally, its compact size ensures a compact design footprint and means that the connector can be used in a wide variety of applications.

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