BTFW30P-3SBTADE4LF

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The BTFW30P-3SBTADA4LF is a rectangular edge type mezzanine board to board connector, designed for high density and high speed data signal transmission. It features a low profile clip-on type design that offers superior mechanical strength and ensures firmly secured connection. BTFW30P-3SBTADA4LF is a reliable platform ideal for a range of data communication applications and offers a range of benefits, in order to maximize system performance and efficiency.

The BTFW30P-3SBTADA4LF has a user-friendly pin design which provides controlled impedance and crosstalk for a highly reliable connection. The connector offers two rows of 15 positions, which enables data transfer up to 150 Mbps and supports a wide range of applications, such as multi-gigabit Ethernet, Internal/USB3.0/USB2.0/3HD, and can support signal integrity up to PAM 2. The connector also has an operating temperature range of -20°C to +85°C and two levels of polarization that ensures proper mating alignment.

The BTFW30P-3SBTADA4LF offers a combination of durability and high performance features for a range of data communication applications. It offers a high retention force which ensures a reliable connection while minimizing the risk of data drop out. This connector also has an integrated cut-out that ensures positive contact mating and prevents interference. In addition, the connector is designed for easy installation and removal, as it features a central clip-on scoop that helps in easy insertion and extraction without damaging the contacts.

The BTFW30P-3SBTADA4LF also features gold plated terminals, which is ideal for high-speed communication. The contacts and shell are made with high quality copper alloy and are RoHS * compliant, making this connector a reliable option for data communication. Furthermore, this connector is halogen free and features a thermoplastic insulator that helps reduce the risks of electrostatic discharge.

The BTFW30P-3SBTADA4LF is a reliable, high-performance connector built for a range of data communication applications. It offers superior mechanical strength and high retention force which ensure an effective connection with minimal risk of data loss. In addition, the connector has a thermoplastic insulator and gold-plated terminals which helps reduce electrostatic discharge and achieve a signal integrity of up to PAM 2. This connector is an ideal solution for multi-gigabit Ethernet, internal/USB3.0/USB2.0/3HD, and other data communication applications.

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