BTH-060-09-L-D-A Allicdata Electronics
Allicdata Part #:

BTH-060-09-L-D-A-ND

Manufacturer Part#:

BTH-060-09-L-D-A

Price: $ 6.99
Product Category:

Connectors, Interconnects

Manufacturer: Samtec Inc.
Short Description: .5MM DOUBLE ROW TERMINAL ASSEMBL
More Detail: 120 Position Connector Header, Outer Shroud Contac...
DataSheet: BTH-060-09-L-D-A datasheetBTH-060-09-L-D-A Datasheet/PDF
Quantity: 1000
1 +: $ 6.35040
Stock 1000Can Ship Immediately
$ 6.99
Specifications
Series: BTH
Packaging: Tube 
Part Status: Active
Connector Type: Header, Outer Shroud Contacts
Number of Positions: 120
Pitch: 0.020" (0.50mm)
Number of Rows: 2
Mounting Type: Surface Mount
Features: Board Guide
Contact Finish: Gold
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 14mm
Height Above Board: 0.522" (13.25mm)
Description

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The BTH-060-09-L-D-A is a rectangular connector array designed for a variety of board-to-board applications. This type of connector was developed for use in components requiring an increased number of terminations or high density. The BTH-060-09-L-D-A provides up to 114 contacts per array, making it ideal for complex high-speed applications such as memory modules, mezzanine connectors, and devices requiring adherence to agricultural/electronics standards, such as those related to automotive and medical applications.

The BTH-060-09-L-D-A connector array is designed to meet industry standards such as the JEDEC EIA 306 and IPC-6150. It is available in multiple options including surface mount, panel mount, press-fit, and reflow solder mount versions. The connectors offer a low-profile profile design and are designed for simple and reliable application and removal.

The contact layout design of the BTH-060-09-L-D-A connector and its unique 3mm design allows for a high-density connection while ensuring a secure fit. It utilizes a double cantilever contact system which provides a secure connection without the need for additional retention mechanisms. This contact system is designed to ensure maximum stability of the connection while allowing for the reduced board space that this type of connector requires.

The BTH-060-09-L-D-A connector array has a low mating force and a low insertion force. This allows for a simpler and faster assembly process. The connector utilizes a series of anti-shorting and polarization features which ensure a proper connection. These features allow the connection to be provided with an optimal level of conductivity and performance.

The BTH-060-09-L-D-A connector array is designed to ensure the highest possible signal integrity in high speed data applications. Both the signal and the power connections are secured using the double cantilever contact system. This ensures that the connection is performance-oriented and reliable. The contact system utilizes a two-row design with high contact temperatures and low contact resistance.

The BTH-060-09-L-D-A connector array is also designed with an integrated locking system that prevents accidental disconnection. The connectors are designed to be compatible with all current interfaces as well as SMESE(Surface Mounted Electronic Security Engineering Standard) and DSM (Dual Security Mounting Standard). These features ensure a secure and reliable connection.

The BTH-060-09-L-D-A connector enables hassle-free and flexible board-to-board application. The connector provides reliable electrical contact and is easy to install. The wide range of board-to-board connection options allows the user to customize the connection for their specific needs. The connectors are available in several sizes and configurations to fit most electrical systems.

The BTH-060-09-L-D-A connector array is a great choice for board-to-board applications in a wide range of industries. It provides a cost-effective solution for high-speed applications, mezzanine connectors, and memory modules. The connector’s unique design and construction also makes it suitable for applications requiring adherence to agricultural/electronics standards, such as those related to automotive and medical applications.

The specific data is subject to PDF, and the above content is for reference

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