BXRC-27E1000-D-73-SE

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LED Lighting - COBs, Engines, Modules is a type of lighting solution that uses multiple, small light-emitting diodes. The term "COB" stands for "chip-on-board," which refers to an assembly process that places several LEDs onto a circuit board, allowing them to be lit simultaneously. The BXRC-27E1000-D-73-SE is a high power LED module in the chip-on-board format. It features a Cree Xlamp XP-E die that emits 1000 lumens of light for a current draw of 1.2 amps.

The working principle of the BXRC-27E1000-D-73-SE LED module is based on the principles of photon emission and absorption. The module includes a Cree Xlamp die that is mounted on a circuit board. This die is composed of a number of tiny LEDs that are connected in series. When an electric current is applied to the die, electrons are excited and they release photons, or light particles, which then travel through the die to create a “light cone” of photons. As the photons travel through the die, they are absorbed by the LEDs, creating the illumination effect.

The BXRC-27E1000-D-73-SE LED module is designed for a wide range of applications including automotive, general purpose lighting, and sign displays. It is ideal for applications where high output and a compact form factor are required. The module is also suitable for use in applications where dimming or color control is desired. The module is RoHS compliant and operates from an input voltage of 10.5-14.5 V.

The BXRC-27E1000-D-73-SE LED module offers excellent reliability and performance. It features a high power factor along with a long lifetime of up to 50,000 hours at ambient temperatures. The module is also certified by the Electronics Industry Alliance for use with the CCT (Correlated Color Temperature) system to ensure superior color rendering.

The BXRC-27E1000-D-73-SE LED module is an excellent choice for high performance and energy-efficient lighting applications. It is easy to install and offers superior light quality and performance. The module is designed to be used with compatible drivers and heat sinks in order to ensure superior heat management and performance.

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