C0603C101K5RACTU Capacitors

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1. Describe

KEMET's X7R dielectric has a maximum temperature of 125°C Working temperature, regarded as temperature stable. Electronic components, components and The Materials Association (EIA) describes the X7R dielectric as Class II materials. The components of this classification are Fixed ceramic dielectric capacitor, suitable for bypass and Decoupling application or frequency discrimination Circuit with stable Q value and capacitance characteristics unimportant. X7R shows predictable changes Relative to the capacitance of time and voltage, there are The smallest change in capacitance relative to the environment temperature. Capacitance change is limited to within ±15% −55°C to +125°C.

2. Feature

    1. −55°C to +125°C operating temperature range

    2. Lead-free (Pb), compliant with RoHS and REACH standards

    3. Temperature stable dielectric

    4. Environmental impact assessment 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2220, And 2225 case sizes

    5. DC voltage ratings are 6.3 V, 10 V, 16 V, 25 V, 35 V, 50 V, 100 V, 200 V and 250 V

    6. Capacitance range from 10 pF to 47 μF

    7. Available capacitance tolerances are ±5%, ±10%, and ±20%

    8. Non-polar device to minimize installation problems

    9. 100% pure matte tinned termination finishes allowed Excellent solderability

  10. SnPb termination completion options are available on request (Minimum 5% lead)

3. Applications

    Typical applications include decoupling, bypass, filtering and transient voltage suppression.

4. Package overview

5. Storage & Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt.