Allicdata Part #: | CES-145-02-S-D-ND |
Manufacturer Part#: |
CES-145-02-S-D |
Price: | $ 7.68 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Samtec Inc. |
Short Description: | LOW PROFILE .025" SQUARE STRIPS |
More Detail: | 90 Position Receptacle Connector Through Hole |
DataSheet: | CES-145-02-S-D Datasheet/PDF |
Quantity: | 1000 |
1 +: | $ 6.91110 |
Insulation Color: | Black |
Contact Finish Thickness - Post: | -- |
Contact Material: | Phosphor Bronze |
Contact Shape: | Square |
Insulation Material: | Polybutylene Terephthalate (PBT) |
Applications: | -- |
Voltage Rating: | -- |
Current Rating: | -- |
Features: | -- |
Ingress Protection: | -- |
Mated Stacking Heights: | -- |
Contact Finish - Post: | Tin |
Material Flammability Rating: | UL94 V-0 |
Operating Temperature: | -55°C ~ 125°C |
Contact Length - Post: | 0.223" (5.66mm) |
Insulation Height: | 0.200" (5.08mm) |
Series: | CES |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Finish - Mating: | Gold |
Fastening Type: | Push-Pull |
Termination: | Solder |
Mounting Type: | Through Hole |
Row Spacing - Mating: | 0.100" (2.54mm) |
Number of Rows: | 2 |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions Loaded: | All |
Number of Positions: | 90 |
Style: | Board to Board |
Contact Type: | Female Socket |
Connector Type: | Receptacle |
Part Status: | Active |
Packaging: | Bulk |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The CES-145-02-S-D is a part of the rectangular connectors product family. It is a two-position header designed to be compatible with either standard or customized PCB designs. The CES-145-02-S-D is available in several sizes and is capable of carrying up to 5A current.
The standard housing material is UL94V-0 rated nylon. The custom housing is available in polyamide or glass-filled PBT. The CES-145-02-S-D has a double-ridge contact system that provides secure contacts and is designed to reduce assembly time.
The contact system is based on a two-point spring-loaded systéme which provides even contact force throughout the mating cycles. The contacts are surface mount soldered onto the PCBs and require less space than traditional DIPs while still providing reliable connections. The contacts are made of phosphor bronze, and are available in gold, tin and tin/lead platings. The contact area is shielded and the jacket material is UL94V-0 rated.
The CES-145-02-S-D is well suited for a variety of applications, such as industrial controls, telecommunications, consumer appliances and medical equipment. It is a reliable and cost-effective solution for applications that require high-speed, low-power device connections.
The working principle of the CES-145-02-S-D is based on a two-point spring-loaded system, which provides secure contact force during mating cycles. The contacts are soldered on the PCBs and provide low-resistance connections. The contact area is shielded and the jacket material is UL94V-0 rated. The contacts are made of phosphor bronze and available in gold, tin and tin/lead platings. The standard housing material is UL94V-0 rated nylon.
The CES-145-02-S-D can be used in conjunction with a variety of headers, receptacles and female sockets to build a reliable and cost-effective device connection system. It is designed to ensure secure contact force, even during repetitive mate-and-unmate cycles. The CES-145-02-S-D is designed for low-power device connections and is capable of delivering up to 5A of current.
In conclusion, the CES-145-02-S-D is a two-position header designed for use in a variety of applications. It is designed to provide low-resistance connections and is capable of delivering up to 5A of current. The contacts are made of phosphor bronze and are available in gold, tin and tin/lead platings. The contacts are soldered on the PCBs and the contact area is shielded and contained within a UL94V-0 rated nylon housing. The CES-145-02-S-D is a reliable and cost-effective device connection solution for applications that require high-speed, low-power device connections.
The specific data is subject to PDF, and the above content is for reference
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