CIM-9-65-70-36-AC30-F4-3

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LED lighting has become increasingly popular over the past decade, and with it come new and improved versions of existing technologies.One such technology is CIM-9-65-70-36-AC30-F4-3, which is used in a variety of applications. This article will examine the application field and working principle of this technology.

CIM-9-65-70-36-AC30-F4-3 is a compact, lightweight LED package for applications where a wide viewing angle is required. It is available in both single and multi-die formation and can be used for backlighting, lighting signage, architectural lighting and general illuminations. The CIM-9-65-70-36-AC30-F4-3 uses chip-on-board (COB) technology, which essentially means that the LED chip is directly mounted onto the substrate. This eliminates the need for traditional LED packages and results in unprecedented efficiency, as well as a long lifetime.

The CIM-9-65-70-36-AC30-F4-3 provides a wide range of illumination. It is equipped with a zoom lens and provides a wide viewing angle of up to 120°, allowing it to cover a large area with an even color temperature. It also has a wide dimming range, allowing it to be used in both commercial and residential applications.

In terms of its working principle, the LED package has a simple construction. It consists of a LED die, a metal core substrate, a heatsink for heat dissipation, and a lens for beam shaping and focusing. The LED die is connected to the metal core substrate using solder bumps, and the heatsink is then attached to the substrate. The lens is then placed in front of the die, and it focuses and shapes the emitted light.

The CIM-9-65-70-36-AC30-F4-3 is a versatile and efficient LED package for a variety of lighting applications. It offers high brightness and a wide viewing angle, as well as a wide dimming range. Additionally, its compact design and lightweight construction makes it ideal for applications where space and weight are a concern.

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