CLP-103-02-F-S

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The CLP-103-02-F-S is a Rectangular Connector - Header, Receptacle, Female Socket. This component of interconnect technology is generally used for power supply and distribution systems, data distribution, and other applications where a right angled female socket is best suited. It is designed for applications where reliable performance is virtually guaranteed by the combination of board-to-board connection methods and the simple and reliable CLP-103-02-F-S connector.

General Characteristics

The CLP-103-02-F-S is configured with a high-temperature retaining plastic housing, low-temperature retaining plastic cover, and stainless steel positioning pins. It features two simultaneously-operating, contact-valve contacts. It has a current rating of 3A per contact and an operating temperature range from -40°C to +105°C. The CLP-103-02-F-S is designed to mate with fewer than 40 mating cycles in its operational life. It should be noted that the CLP-103-02-F-S is not intended for printed circuit board (PCB) connections, and should not be used in situations likely to require high-current or high-voltage connections.

Application Field and Working Principle

The CLP-103-02-F-S is a right-angle female socket designed for applications where reliable performance is required. It is commonly used in power supply and distribution systems, data distribution, and other applications. A board-to-board connection method, using two contact valves operated simultaneously, is used to establish a connection with the CLP-103-02-F-S. The retaining plastic housing and low-temperature retaining plastic cover provide a secure fit to the board, while stainless steel positioning pins prevent the CLP-103-02-F-S from shorting.

The CLP-103-02-F-S provides a reliable connection for electrical devices. It is designed to operate under up to 3A of current and within a temperature range of -40°C to +105°C. The CLP-103-02-F-S features two contact valves that are operated simultaneously when a connection is to be established, ensuring a secure connection between the CLP-103-02-F-S and the mating component. The retention of the CLP-103-02-F-S by the board is further enhanced by the plastic housing and positioning pins.

Successful Integration

To achieve a successful integration of the CLP-103-02-F-S into an application, it is important to consider the correct contact material, terminal location, and current ratings. When selecting a contact material, gold is desirable because of its superior performance in harsh environments, but silver is more economical and may be used in less demanding applications. The terminals should be located along the edge of the board in an array that will minimize physical stress on the contacts. The current rating for the CLP-103-02-F-S is 3A per contact.

When designing an assembly incorporating the CLP-103-02-F-S, it is important to follow good design practices for solder heat sink pads, board-to-board spacing, and trace design. The solder heat sink pads must be large enough to provide thermal relief for the mating components. The board-to-board spacing needs to be large enough to allow for the appropriate insertion length of the CLP-103-02-F-S. Finally, the design of the circuit trace should provide sufficient current-carrying capacity for the current passing through the CLP-103-02-F-S.

Conclusion

The CLP-103-02-F-S is a reliable, cost-effective rectangular connector - header, receptacle, female socket that is well suited for a variety of applications, including power supply and distribution systems and data distribution. It is designed for applications where reliable performance is virtually guaranteed by the combination of board-to-board connection methods and the simple and reliable CLP-103-02-F-S connector. To ensure a successful integration of the CLP-103-02-F-S into an application, the correct contact material, terminal location, and current ratings must be used along with good design practices for solder heat sink pads, board-to-board spacing, and trace design.

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