CP2-HD176-GE1-KR Allicdata Electronics
Allicdata Part #:

CP2-HD176-GE1-KR-ND

Manufacturer Part#:

CP2-HD176-GE1-KR

Price: $ 7.12
Product Category:

Connectors, Interconnects

Manufacturer: 3M
Short Description: COMPAK PCI STD SIGNAL
More Detail: Position Connector
DataSheet: CP2-HD176-GE1-KR datasheetCP2-HD176-GE1-KR Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
576 +: $ 6.46758
Stock 1000Can Ship Immediately
$ 7.12
Specifications
Series: --
Packaging: --
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Type: --
Connector Style: --
Number of Positions: --
Number of Positions Loaded: --
Pitch: --
Number of Rows: --
Mounting Type: --
Termination: --
Connector Usage: --
Contact Finish: --
Contact Finish Thickness: --
Voltage Rating: --
Operating Temperature: --
Features: --
Description

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Backplane connectors, also known as board-to-board connectors, are essential components of many electronic system designs and are vital for their secure, reliable operation. Most designs require cables that must efficiently transport power and data signals from one circuit board to another as well as between boards within the same system. The design and capabilities of these connectors vary significantly based on the requirements of the application. As such, there are a broad variety of connector types available on the market to satisfy a wide range of needs.

CP2-HD176-GE1-KR connectors are an excellent choice for a variety of industrial and medical electronics applications. These backplane connectors are specifically designed to meet the requirements of the Hard Metric standard. They feature high-density board-to-board connections with a consistent and reliable mating system. This makes them well-suited for applications that require high-speed signal transfer over long distances.

CP2-HD176-GE1-KR connectors incorporate an easy-to-use housing design. The bodies of the connectors are equipped with spring-loaded guide pins for reliable mating and secure connection. The thermoplastic housing allows for quick and easy installation and removal from the mountpoints without any additional components or tools. The simple design of the housing helps to ensure efficient, trouble-free mating. Additionally, the connector housings feature a protective insulating barrier to ensure that adjacent contacts remain safe and protected during operation.

These backplane connectors feature a total of 176 high-speed signal contacts that have a broad contact force range and are rated for high-frequency operation. As such, these connectors are ideal for a variety of high-speed data applications. The contact design features a low-profile, gold-plated contact surface that ensures optimized signal integrity. The signal contacts of the connector are housed in a LEMO-compatible dielectric material to provide additional protection from outside elements. The contacts are equipped with solder-clad male pins for reliable connection and grounding.

The CP2-HD176-GE1-KR connectors are compatible with a broad range of standardization initiatives. This includes the popular Hard Metric Initiative (HMI). The HMI aims to provide an universal metric reference system for connector and signal mappings, making these connectors well-suited for a broad range of applications where standardization is critical. Additionally, the connectors are compatible with a variety of popular interface standards, including Gen 2 VRSpeed and LVDS, providing further application versatility.

In conclusion, CP2-HD176-GE1-KR connectors are an excellent choice for high-speed data applications that require a reliable connection over long distances. The simple, yet effective, design of the connector allows for rapid installation and maintenance while providing superior signal integrity. Additionally, the connectors are compatible with a variety of popular standards, including WM and the Hard Metric Initiative, making them an ideal choice for many industrial and medical electronics applications.

The specific data is subject to PDF, and the above content is for reference

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